Industry Directory | Manufacturer
The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.
New Equipment | Solder Materials
AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t
New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
Electronics Forum | Mon Apr 26 09:46:05 EDT 1999 | C.K.
Chrys: I have checked all the basic elements of Wave solder joint formation: fluxing, preheating, and lastly soldering. For checking the fluxer, i used a product from ECD that's very similar to what you desribed called the flux-o-meter. It did a
Electronics Forum | Fri Jan 13 11:57:51 EST 2006 | james
I am reworking some BGAs and just trying to find the easiest way to do it. Can you use tacky flux without solder on the pads to reflow? or do you have to have solder on the pads before placing the BGA to reflow? Any info is appreciated. thanks
Used SMT Equipment | Chipshooters / Chip Mounters
Samsung chip mounter SM-421 Advanced Flexible Mounter Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to □22mm IC part through On-The-Fly reco
Used SMT Equipment | Chipshooters / Chip Mounters
Advanced Flexible Mounter Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to 22mm IC part through On-The-Fly recognition. It also allows recognition of parts with
Industry News | 2011-05-17 11:04:30.0
High Yield BGA Reballing Simplified
Industry News | 2017-07-09 20:40:11.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
ALPHA® Preforms with solder paste adds solder volume.
