HANDI-VAC KIT, Static dissipative, with conductive silicone vacuum cups. (1) 1/8" and (1) 1/4" vacuum cups on bent probes and (1) 1/8" and (1) 3/8" vacuum cups on straight probes. Our HANDI-VAC kits are a low cost pick-and-place tool that can go in
Electronics Forum | Thu Jan 04 12:51:37 EST 2007 | Board House
Hi Chunks, Starting copper on outer layer with .0007 is 1/2 oz. copper foil. so if starting copper is .0007 and your Board house will plate an additional .0021 mils of copper. which will give you a finished copper weight of .0028 Mils or (2 oz.) Y
Electronics Forum | Thu Oct 27 12:58:33 EDT 2005 | gregp
EIA-481-B Max tape thickness 1.1mm (not including bottom and top cover tapes which can be .1mm max each) Of course a 1.1mm thick piece of steel will be stiffer than a 1.1mm thick lasagna noodle (already cooked). Is the thickness the issue or is it t
Tank Capacity: 85 gallons (322 liters) Heat: 12,000 watts total heat at 230 Volt, 3 Phase. Heaters are derated at lower voltages. Overall Dimensions: 38" x 48" x 40"H Shipping Weight: Approximately 600 lbs. Evaporation Rate: 4 - 6 gallo
HEPCO Model 3000-2 Single-Stroke Pneumatic Operation with Easily Interchangeable Dies Durable, Accurate, Maintenance Free, Simple to Use, Efficient, Versatile Die changes in under 1 minute Steel base for extremely long life Large v
Industry News | 2019-01-14 19:40:46.0
Seika Machinery today announced plans to introduce the N=1 Checker First Article Inspection System in Booth #2343 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center.
Industry News | 2019-08-22 13:45:15.0
Techcon announced the release of its new 50ml Dual Syringe Dispenser designed for hassle-free dispensing of 50ml dual syringes. The new Dual Syringe Dispenser can accommodate conveniently packaged 50ml side-by-side syringes, in ratios 1:1, 2:1, 4:1 and 10:1.
Detailed Product Description Brand: Ipulse Part Name: PICK UP NOZZLE Model: K04 Size: 1.8/ 1.1 Machine Model: FV7100 Origin: Japan Ipulse FV7100 Pick Up Nozzle K04 Nozzle Size ø 1.8/ ø1.1 good quanlity Description: 1, Part Name: Pick Up Noz
Technical Library | 1999-08-27 09:29:49.0
Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective...
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
Facilities: AC 110 / 220V 50/60Hz, 5~8 bar Dims: 1000W * 980L * 1300H (mm) Product Terms: This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional either live or by video for y
Career Center | Mysore, India | Engineering,Production,Quality Control,Technical Support
· New Product production line setup, Risk assessment, quality system deployment. · Process Engineering activities, PCB Design review w.r.t Design for manufacturability in Pilot lot. · Printed wiring Assembly Process Improvement (Stencil, PCB type, sc
EMPFasis - Vol. 1 - No. 1 Login Account Wishlist Cart Toggle navigation Account Home Product Finder Advanced Search Contact Us Login Home > Publications > Digital Downloads
PCB Libraries Forum : Variant question + 1:1 PCB printout PCB Libraries Forum : Variant question + 1:1 PCB printout This is an XML content feed of