Industry News | 2010-09-26 16:12:24.0
STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that its BGA Reballer Kit allows components to be reused.
Industry News | 2015-01-05 20:24:41.0
Sono-Tek Corporation (OTC QB: SOTK) is pleased to announce the company’s 40-year anniversary. Sono-Tek has delivered more than 10,000 ultrasonic coating systems around the world during the company's history. Sono-Tek Corporation was established in 1975 by Dr. Harvey Berger, inventor of the ultrasonic nozzle. Sono-Tek’s initial developments included fuel efficient nozzles for lower emission oil burners sponsored by the EPA, and blood collection tube coaters for a major pharmaceutical company. Sono-Tek next developed the SonoFlux line of ultrasonic spray fluxing equipment, now used by countless printed circuit board (PCB) manufacturers around the world.
Industry News | 2020-01-08 16:46:29.0
Sono-Tek Corporation is pleased to announce the company’s 45-year anniversary. A world leader in ultrasonic coating equipment solutions since 1975, Sono-tek has delivered more than 10,000 ultrasonic coating systems around the world. The company was established in 1975 by Dr. Harvey Berger, inventor of the ultrasonic nozzle, with the ultimate goal of helping as many people as possible solve coating problems with his unique technology.
Industry News | 2011-09-26 17:14:18.0
Sono-Tek, a worldwide precision ultrasonic coating equipment manufacturer, announces the company’s 35-year anniversary.
Industry News | 2010-03-04 11:30:26.0
POWAY, CA — March 2010 — EasySpheres recently finalized and opened an enhanced Web-based ordering portal for customers interested in purchasing solder balls and/or solder spheres for BGA rework applications and low-volume manufacturing.
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
Industry News | 2006-02-01 09:05:56.0
Discover the Solderite Difference
Industry News | 2022-04-13 09:49:32.0
Indium Corporation's Ross Berntson, President and COO, will deliver the keynote presentation at TestConX, to be held May 1-4, in Mesa, Ariz., US.
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