Fast, Simple and Accurate Conformal Coating Inspection. CX150i™ automates inline conformal coating inspection process using a brand-new UV Strobed Inspection Module (SIM). Based on proven AOI technology, CX150i™ gives you the assurance of quality, c
Offers original SMT feeders for Panasonic/KME - Electronic Component Mounting Equipment Models as following AM100 NPM CM20 CM202 CM301 CM101 CM212 CM401 CM402 CM602 BM221 BM123 BM223 MV2 MV2C MV2F MV2V MV2VB MCF MSF MPAG3 MSR HT sales@smtbox.
Electronics Forum | Thu Mar 23 23:21:10 EST 2006 | AR
100 cm/min) the motor runs without complaint. Too bad we run the conveyor as slowly as 10 cm/min... I'll try replacing the control board next when I get my hands on one.
Used SMT Equipment | SPI / Solder Paste Inspection
PARMI/SPI SPIHS60 MACHINE PARMI HS60 (supreme) solder paste thickness tester SPI The SPI HS60 (supreme) series is the next generation fastest online solder paste inspection system on the market. The measurement speed at a resolution of 13x13um is
Used SMT Equipment | Pick and Place/Feeders
Complete line liquidation Including Europlacer lightly used iiNeo Pick and Place System Also Included in Same Auction 2013 Europlacer IINEO Multi Function SMT Pick & Place Machine (low hours/placements) (2) 2103 Europlacer ii Feeder Trolley’s
Industry News | 2014-03-02 18:55:28.0
PARMIannounces that it will exhibit in booth #1249 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
Industry News | 2014-03-26 12:46:54.0
PARMI announces that it has been awarded a 2014 NPI Award in the category of Test & Inspection – SPI for its SIGMA X series solder paste inspection system.
Parts & Supplies | Assembly Accessories
Detailed Product Description Part Name: LNC60 I/F Cable ASM Part Number: 40070445 Machine: JUKI KE2070 2080 FX3 Machine Condition: Original New Brand: JUKI Application: For LNC60 Laser 40070445 LNC60 I/F Cable ASM(2012) For JUKI 2070 2080 FX3 Mac
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
| https://productronica.com/de/messe/aussteller/anmeldung-preise/preise-kombipakete/
. 100 x 50 x 100cm mit 1 x Barhocker Online-Pressefach: Einstellen von 2 Pressetexten und 2 Bildern Entsorgungspauschale Energiekostenzuschlag Bitte beachten Sie
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/06/688951_OvenSetupWizard-XP4021.pdf
point is entered or if it is out of tolerance band and retrying (hunt) for final position. (range 0.5-3cm) Home Distance: Board width distance when rail is on home switch. (range 0-100cm). Travel Distance: is a minimum and maximum distance that user can
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