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Electronics Forum | Mon Jan 29 16:12:05 EST 2001 | bill_scholl
I have been told that is is possible to reflow solder through hole components. Can anyone confirm this is being done reliably? If so, what are the required equipment, steps and processes? What is the reliability of the solder joints? Is this a genera
Electronics Forum | Mon Jan 29 20:31:44 EST 2001 | davef
It's common. We've talked about it here several times. Hopefully the fine SMTnet Archive that are available are helpful. If there not talk back. Other sites that are sources of information are: * SMT Magazine * Bob Willis * Phil Zarrow * Amp[c
1999 Fuji CP-643E SMT Pick & Place Approx Dimensions: 16'2" x 78" x 76" Location: Jasper, IN USA Serial: 1108 Features: o 4800 Vision Card o Narrow and Wide Camera o Capable of 0402 Component part placement o Pam Data Provided o Copy of Machine Prop
Many Fuji Sparr parts for sales.. No Part No. Description Qty. Machine 1 GPH4580 HOLDER 7 CP43 2 MPH0472 PISTON 19 CP43 3 GPL1200 PIN 8 CP43 4 S1046A CIR-CLIP WR19 10 CP43 5 PPQ1020 PIN,LOCATING 1 CP43 6 GXT2333 HOLDER,PIN 2 CP43 7 MPA5031 COLLAR 2 C
NXT CPU BOX SERVO AMP XB02290 SMT CPU board, system board , driver board FH1011B-0 BOARD FH1015A-0 BOARD FH1108B PC BOARD FH1119AO QP3 BOARD(PCB) FR0000465 FS-V21R-0 FU-67V-0 GFQC0020 PLATE GFQC1220 CYLINDER GFTR8220 TIMING PULLEY GFTR8
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Technical Library | 2012-08-02 21:05:14.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Pure tin is a common finish for copper hook up wire, coaxial cable, ground braid and harness assemblies used on electronic assemblies. Historically there have been fewer reports o
Technical Library | 2013-08-07 21:52:15.0
PCB architectures have continued their steep trend toward greater complexities and higher component densities. For quality control managers and test technicians, the consequence is significant. Their ability to electrically test these products is compounded with each new generation. Probe access to high density boards loaded with micro BGAs using a conventional in-circuit (bed-of-nails) test system is greatly reduced. The challenges and complexity of creating a comprehensive functional test program have all but assured that functional test will not fill the widening gap. This explains why sales of automated-optical and automated X-ray inspection (AOI and AXI) equipment have dramatically risen...
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.