Industry News | 2003-06-03 08:20:48.0
Designed for fast and easy DIN-rail mounting
Industry News | 2014-12-17 19:57:30.0
Fuji's Scalable Placement Platform NXT III now supports 0201 mm (0.25 x 0.125 mm, 008004") components as standard. By loading the newly developed H24G head on the NXT III, 0201 mm (0.25 x 0.125 mm, 008004") components can be supported without any change to the specifications of the machine (speed: 35,000 cph, accuracy: ±25 μm). The Intelligent Part Sensor (IPS), which checks the orientation of parts on the nozzle and ensures that the part does not remain on the nozzle after placement, is standard on the H24G placement head.
Industry News | 2021-11-03 12:10:50.0
Vishay Sfernice Series supplies High Rotational Torque of 8Ncm in Compact 12.5mm Size
Industry News | 2020-12-18 11:29:38.0
New Sizes for the Electrical Double-Layer Energy Storage Capacitors Range from 10 mm x 20 mm to 12.5 mm x 40 mm, With Capacitance From 5 F to 22 F
Industry News | 2019-12-16 22:42:05.0
T1 is a multi-function placement machine, also a submicron flip eutectic placement machine, providing placement accuracy up to 5 microns, suitable for all kinds of flip chip, common chip mounting, can handle the minimum chip spacing as low as 50 microns.
Industry News | 2016-10-11 13:26:07.0
CAMI Research Inc. (Acton, MA) announces another new board for its CableEye cable and harness testing systems. Populated with solder pads to accept both aligned and staggered, 1.25mm and 1.5mm pitch, surface mount and through hole (TH) connectors, the board addresses any market with a demand for board-to-board connections. Rated to 700Vdc/500Vac, the CB51 may be used on all CableEye models.
Industry News | 2013-11-08 18:07:48.0
Finetech has developed a new high force configuration of the FINEPLACER® pico ma platform targeting leading-edge anisotropic conductive film (ACF) applications.
Industry News | 2022-05-28 13:29:12.0
New Power Inductor has Increased Inductances, Saturation Current and DCR Values vs. Previous Model
Industry News | 2016-03-22 16:57:05.0
Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.
