Material: FR-4 Layer Coverage: 2L Thickness: 3.2MM Surface Technique: Immersion Gold Line Width/Space: 12mil/12mil Solder Mask Color: Green
Layer: 2 layer Materials: PI Copper Thickness: 35um Min Board Thickness: 0.1mm Surface coating: HAL, HAL LF, Immersion Gold, Immersion Tin, Immersion Silver PI thickness: 1/2mil, 1 to 10 mil ADH thickness: 1/2mil, 1mil FPC, flexible PCB OEM/OD
Material: FR4 Layer Coverage: 12L Thickness: 3.2MM Surface Technique: Immersion Gold Line Width/Space: 12mil/12mil Solder Mask Color: Green
Materials: FR-5 Tg 180 Copper Thickness: 2 oz Layer Count: 4 Layer, 1.6 mm Min. Hole Size: 12 mil Min.Line Width/Space: 6 mil Finishing : Leadfree HAL
Materials: FR-4 Copper Thickness: 3 oz Layer Count: 6 Layer, 1.6 mm Min. Hole Size: 12 mil Min.Line Width/Space: 6 mil Finishing : Immersion Gold
Materials: FR-4 Copper Thickness: 1 oz Layer Count: 4Layer, 1.6 mm Min. Hole Size: 12 mil Min.Line Width/Space: 8 mil Finishing: Immersion Gold + Carbon ink
Cost effective automated stencil printer with SMTrue(TM) Vision Assist for precise alignment of stencil to PCB boards down to 12 mil ultra fine pitch components. Obtain high quality stencil printing of printed circuit boards with the SPR-45VA with S
Surface Mount, Through Hole, or Mixed Technology on Single or Double Sided PWB assemblies BGA, CSP, components to 0402, Fine Pitch to 12 mils, 100% passive testing prior to placement. In-circuit programming, full functional testing and automated opt
9 SMT Assembly Lines Total placement capability 150,000 components/hr Fine pitch placement up to 12mil Component Ranges: 0201 to BGA and uBGA up to 55mm square 40 microns placement accuracy with 4 sigma capability RoHS Compliant Lines with N2 envi
New Equipment | Design Services
Layer：4 Material：FR-4 4/4/4/4oz Thickness：2.0 Minimum hole：0.35mm Minimum Tracc/Spacing：12mil/15mil Application：power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space:
