Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Industry Directory | Manufacturer
Quickturn Assembly services include: SMT,double sided ,fine pitch to 12mil,BGA, microBGA,and THRU hole, Pb free if needed. Testing, Repair, Conformal coating, Powder coating, and Potting.
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New Equipment | Rework & Repair Equipment
The ZM-R730A BGA Rework Station can place very small BGA's down to 0.1mm pitch, large BGA's up to 90mm on standard models and can be cusomized to place up to 130mm Chips. Currently the only machine available on the market with a robotic Vision System
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
Electronics Forum | Sat Oct 07 16:31:56 EDT 2000 | Elfego
Tray the electroform stencil.
Electronics Forum | Tue Oct 10 20:14:01 EDT 2000 | Dason C
Hi! CJ. Please advise what is your pitch size ie 15.7 mil or what is your capabiliy can you build the board with pitch 15.75 mil (please note that the actual dimension of the package is 0.4mm), and how many lead on the package. The pad width of Ind
Used SMT Equipment | Pick and Place/Feeders
Mirae Corporation Quad Meridian - 1030P SMT Pick & Place Note: This lot includes an assortment of 10 SMT feeders. Item Location: Uxbridge, MA Serial: M3100-018 Features: 5 Nozzle Head 1 Gantry 4 Modular Heads 1 Precision Upward Precision Camera
Used SMT Equipment | Flexible Mounters
Product Name: Samsung chip mounter CP45FV04 Product number: CP45FV04 Detailed product introduction Item: NEO CP45F/FV Visual Fly Vision (Vision+Stage) Mounting speed: Chip max speed IPC9580, 14900CPH 0.178sec/chip (1608); IC flying camera 0.75s
Industry News | 2010-02-17 18:45:59.0
The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference. Short course descriptions are also being solicited.
Industry News | 2010-05-07 16:01:14.0
New this year! The SMTA International Technical Committee invites you to participate in a poster session at SMTA International. Poster sessions are presented on the show floor and are a great way to present current research and results in a concise manner without requiring a technical paper.
Parts & Supplies | Repair/Rework
The RocHard 1 MilProbe is a 0.3" long Micro-tip in a 4 3/8" long hex shape stainless steel handle. The Micro-tip is tapered to a one mil diameter tip for TAB, BGA, and other ultra fine pitch rework. The tip is either straight (SH-341) or 50? angled a
Parts & Supplies | Pick and Place/Feeders
GSM Multi Pitch Feeder 16mm 47175802 we also supply other Universal accessories (GSM): part no description 46485701 CAMERA(PEC) 45269201 PC BD,PEC ILLUM ASSY 47598301 FLEXJET CLUTCH (OLD) 50121203 FLEXJET MirrorCLUTCH(NEW) 47509501 THETA ENCOD
Technical Library | 2007-06-21 17:03:16.0
The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture (...) While there have been several studies comparing these two attachment methods, this study highlights the effect of rework technique on the electrical characteristics and reliability of reworked BGAs.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
This video describes the J-STD-001 solder certification program. It is an overview of the program, the certification requirements and the types of credentials. For More Information On IPC J-STD-001 Training Visit Our Website: IPC J-STD-001 CIT Cert
EZReball demonstration video. Simple and Fast new reball method! The new BEST EZReball™ process is an answer to your reballing problems. This unique method simplifies the reballing process allowing for better yields and faster reballing times. http:
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Career Center | Houston, Texas USA | Production
Electronic Assemblers / Solderers Temp to hire opportunity! $11 - $13/hour Job Responsibilities 1.) Solder rf, gps and gsm antenna, ps pigtail, fiber leds, buzzer 2.) IPC-610 or mil spec experience a plus 3.) Glue units together 4.) Cut open
Career Center | Gaithersburg, Maryland USA | Production
Acquire materials from inventory and verify quantities against Work Order Documentation. Load part feeders and up SMT equipment according to Up Documentation. Operate SMT equipment safely per Manufacturer's Operating Manual and in-house SMT guideli
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
”, SMTAI Conference Proceedings [9] Investigation Specifics: 680 I/O Plastic BGA, daisy chained, 35x35mm package, 1.0mm pitch, 0.635 (25 mil) diameter solderball
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
. Layer Count 50 Max. Working Panel Size 21" x 31" Max. Board Thickness .300" Min. Board Thickness 0.16"(6L) Min. Line/Space • I/L - 2 / 1.5mil (HDI) • O/L - 2 / 1.5 mil (HDI) Warpage .001" / sq. in. BGA Pitch 0.20mm Layer to Layer Registration 3 mil
