Electronics Forum | Thu Jun 15 14:51:37 EDT 2017 | bmalhi
If machine serial tag referring to 3Ph, 208-240V then you cannot apply 3Ph, 380V. In order to use 3Ph, 380V supply you have, machine needs to be retrofitted to work with this voltage. If you apply 380V without voltage conversion, you will damage som
Electronics Forum | Wed Jun 14 03:21:29 EDT 2017 | bukas
hello everyone, I got a Heller reflow oven that operates at 3x240V and a delta-delta transformer since my grid is 3x380V. the problem I have right now is that there is no neutral line at delta-delta transformer, also there is no neutral line at oven
heller 1809exl 1809MKIII 1808 1800 1707 1700EXL Reflow oven good condition low price heller 1809exl 1809MKIII 1808 1800 1707 1700EXL Reflow oven good condition low price Email:firstname.lastname@example.org Skype:smtdwx M/P/Whatsapp/wechat:+8615915451009
NXTI NXTII NXTII M3 M6S XPF-L XP243 XP143 XP243 USED PICK AND PLACE MACHINE FOR SALE NXTI NXTII NXTII M3 M6S XPF-L XP243 XP143 XP243 USED PICK AND PLACE MACHINE FOR SALE UK DEK automatic printing machine ELA, HORIZON 01, HORIZON 02i, HORIZON 03i
Technical Library | 2010-07-08 19:49:59.0
Aging characteristics of new lead free solder alloys are in question by many experts because of higher amount of tin’s effect on the diffusion of other metals, primarily copper, to create undesirable boundary intermetallics over long periods of time and even moderately elevated temperatures. A primary layer of intermetallics, Cu6Sn5 forms as the liquid solder makes contact with the solid copper substrate. This reaction however ceases as the solder temperature falls below that of liquidus. A secondary intermetallic Cu3Sn1, an undesirable weak and brittle layer, is thought to form over time and may be accelerated by even mildly elevated temperatures in electronic modules such as laptops under power. This project was designed to quantify the growth rate of Cu3Sn1 over an extended period of time in a thermal environment similar to a laptop in the power on mode.
Technical Library | 2007-08-02 13:24:23.0
This paper presents the results of a joint - three way study between Amkor Technology, Panasonic Factory Solutions and Spansion in the area of package on package (PoP) board level reliability (BLR) (...) The scope of this paper is to cover the already popular 14 x 14mm PoP package size that provides a 152 pin stacked interface which supports a high level of flexibility in the memory architecture for multimedia requirements.
Career Center | , | 2013-03-07 10:18:07.0
Currently work as Equipment Engineer at Integrated Microelectronics Inc., Philippines handles Line Maintenance Technicians, that performs production equipment setup and sustenance. Implements/creates improvements on assigned area. Maintains group KRA
.在可靠性、易用性、响应性、技术和价格价值方面的得分最高。 2001年度SMT行业Vision 奖 类别: 焊接设备 产品: 1800 EXL-S回流焊炉 设立的SMT行业Vision 奖用于将技术和服务上的进步作为优秀基准。 因为1800 EXL-S上的第5代助焊剂分离系统使Heller荣获了焊接设备类别的奖项。 行业专家组总结认为，第5代收集系统创造性地利用新技术解决了助焊剂收集这一具有重大意义的行业挑战。 公司 关于HELLER INDUSTRIES 公司责任 新闻 活动事项 公开论文及技术文
Drivers SMT PCB SMT Valves Others SMT parts Hot Heater 588917 Hot Heating Element for Heller 1707 EXL 586049 Hot Heller 1800 fan servo