New SMT Equipment: 2,0 pan (61)

DCS400-PAN-A(ACS400-PAN-A)ABB Governor panel

DCS400-PAN-A(ACS400-PAN-A)ABB Governor panel

New Equipment | ESD Control Supplies

DCS400-PAN-A(ACS400-PAN-A)ABB DCS400-PAN-A(ACS400-PAN-A)ABB Quick Details Shipment: EMS,DHL,UPS & FEDEX Payment: T/T Supply Ability:  30 Unit/Units per Month Price: The more you order ,the lower price you will get Delivery: In stock,wit

Amikong DCS

DCS400-PAN-A(ACS400-PAN-A)ABB Governor panel

DCS400-PAN-A(ACS400-PAN-A)ABB Governor panel

New Equipment | ESD Control Supplies

DCS400-PAN-A(ACS400-PAN-A)ABB DCS400-PAN-A(ACS400-PAN-A)ABB Quick Details Shipment: EMS,DHL,UPS & FEDEX Payment: T/T Supply Ability:  30 Unit/Units per Month Price: The more you order ,the lower price you will get Delivery: In stock,wit

Amikong DCS

Electronics Forum: 2,0 pan (1)

Double-sided reflow with a Altera 240-pin RQFP

Electronics Forum | Mon Jun 30 16:35:13 EDT 2003 | davef

Hi Steve We don�t double reflow this part. We wouldn�t consider it without a fixture or some other support. You know that sound, the almost involuntary sound that patrons in a restaurant make when a waiter drops a glass or a tray? It�s kind of an

Industry News: 2,0 pan (1)

Henkel increases sales and earnings

Industry News | 2009-03-02 22:58:58.0

Business results reflect National Starch acquisition and Ecolab sale

Henkel Electronic Materials

Parts & Supplies: 2,0 pan (7)

Fuji K5181N CR PAN SCREW FUJI NXT

Fuji K5181N CR PAN SCREW FUJI NXT

Parts & Supplies | Assembly Accessories

 FUJI NRG1022 CAP FUJI NRG1040 NUT FUJI NRG1060 LOCK FUJI NRG1061 HOLDER, CAP FUJI NRG1070 CAP HOLDER FUJI NRG1072 HOLDER, CAP FUJI NRG1080 HOUSING FUJI NRG1081 HOUSING FUJI NRG1090 SPRING FUJI NRG1110 GUIDE FUJI NTB1830 BEARING THRUST

KingFei SMT Tech

Fuji PZ53021 CR Pan Screw FUJI NXT

Fuji PZ53021 CR Pan Screw FUJI NXT

Parts & Supplies | Assembly Accessories

 FUJI NRG1022 CAP FUJI NRG1040 NUT FUJI NRG1060 LOCK FUJI NRG1061 HOLDER, CAP FUJI NRG1070 CAP HOLDER FUJI NRG1072 HOLDER, CAP FUJI NRG1080 HOUSING FUJI NRG1081 HOUSING FUJI NRG1090 SPRING FUJI NRG1110 GUIDE FUJI NTB1830 BEARING THRUST

KingFei SMT Tech

Technical Library: 2,0 pan (17)

Deposition of Solder Paste into High Density Cavity Assemblies

Technical Library | 2018-02-28 22:28:30.0

Circuit functional density requirements continue to drive innovative approaches to high performance packaging. Some new approaches include; aggressive space reduction, embedded solutions, and those that offer some form of risk reduction and rework potential are now options that are being explored by customers. Requirements for assembly of these types of packages necessitate the deposition of solder paste and assembly of components into cavities of the substrates to gain z-axis density as well as area functional density. Advances in the fabrication of PWB’s with cavities using newly developed laser micro-fabrication processes along with increased circuit pitch density of 50 micron lines and spaces permit new applications for high performance electronic substrates. First published at SMTA Pan Pacific Symposium

Celestica Corporation

Effect of Silicone Contamination on Assembly Processes

Technical Library | 2013-02-07 17:01:46.0

Silicone contamination is known to have a negative impact on assembly processes such as soldering, adhesive bonding, coating, and wire bonding. In particular, silicone is known to cause de-wetting of materials from surfaces and can result in adhesive failures. There are many sources for silicone contamination with common sources being mold releases or lubricants on manufacturing tools, offgassing during cure of silicone paste adhesives, and residue from pressure sensitive tape. This effort addresses silicone contamination by quantifying adhesive effects under known silicone contaminations. The first step in this effort identified an FT-IR spectroscopic detection limit for surface silicone utilizing the area under the 1263 cm-1 (Si-CH3) absorbance peak as a function of concentration (µg/cm2). The next step was to pre-contaminate surfaces with known concentrations of silicone oil and assess the effects on surface wetting and adhesion. This information will be used to establish guidelines for silicone contamination in different manufacturing areas within Harris Corporation... First published in the 2012 IPC APEX EXPO technical conference proceedings.

Harris Corporation

Express Newsletter: 2,0 pan (76)


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