Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
ZK Electronic Technology Co., Limited professional in Surface-Mount Technology area and supports most major brands of electronic asembly equipments with a large selections of compatible SMT.
Industry Directory | Manufacturer
Yee Fung Electric Equipment LTD. is one of the foreign capital Hi-tech corporations with advanced technology developing system and advanced production manufacture system. We are professional in design and manufacture soldering machine and parking sys
New Equipment | Curing Equipment
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
New Equipment | Assembly Services
1. PCB transmission machine: For the connection between SMT production lines, Du can also be used for PCB buffering, inspection, Zhi test or manual insertion of electronic components. 2. Application range: dao50mm-500mm wide PCB board. 3. Responsi
Electronics Forum | Mon Dec 22 12:14:15 EST 2008 | pcbbuilders
we sometimes have problems with solder paste release. we use a manual stencil printer. does anyone have any thoughts on using two passes of solder paste on the stencil? i have found that running the second pass gives me better deposits on the fine pi
Electronics Forum | Tue Dec 23 14:45:06 EST 2008 | comatose
One thing that helps is to divide large pads into a series of smaller pads. This prevents the scooping you're talking about.
Used SMT Equipment | In-Circuit Testers
2) Controller(s) B180L & RP5700 ** includes switch boxes and cables ** (2) ASRU C Cards (2) Control Xt Cards (18) Hybrid Double Density Pin Cards (2) 6624 Power Supplies (1) Printer Condition: Complete & Operational “Passes Diagnostics”
Used SMT Equipment | Screen Printers
2002 Speedline UP 2000 Hi E Screen Printer Refurbished by OEM in 2006 Serial: 21223 Features: Cognex 5000; 4 Axis Motion Control; Tactile Sensor; Pass Through Conveyor; 2D Post Print Inspection; Y Snuggers; Vacuum Stencil Wiper;
Industry News | 2003-02-24 09:40:18.0
Will continue the share repurchase program from February 25, 2003 to January 5, 2004.
Industry News | 2016-05-31 22:02:28.0
MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce its sponsorship and participation in the Northern and Southern California Reliability Workshops. The Northern CA workshop is scheduled to take place Thursday, June 9th at the Embassy Suites by Hilton Milpitas Silicon Valley. The Southern CA workshop will take place Tuesday, June 7th at the Green Dragon Tavern and Museum in Carlsbad, CA. Brian D’Amico will present “The Electronics Manufacturing Industry Requirement for 2D and 3D Inspection Technology.”
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Parts & Supplies | Pick and Place/Feeders
LA 16 00316563-02 NOZZLE (SPECIAL VERSION) 4xx 13x6 Di2 00316577-03 CUTTER 00316584-01 SUPPORT ANGLE 00316585-01 SUPPORT ANGLE 00316588-02 Plate 00316590-02 COVER 00316593-01 MAGNET 00316601-03 CONTROL UNIT TAPE CUTTER SIPLAC E 00316602-01 T
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Parts & Supplies | Pick and Place/Feeders
LA 16 00316563-02 NOZZLE (SPECIAL VERSION) 4xx 13x6 Di2 00316577-03 CUTTER 00316584-01 SUPPORT ANGLE 00316585-01 SUPPORT ANGLE 00316588-02 Plate 00316590-02 COVER 00316593-01 MAGNET 00316601-03 CONTROL UNIT TAPE CUTTER SIPLAC E 00316602-01 T
Technical Library | 2024-02-02 07:48:31.0
Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.
Technical Library | 2016-08-11 15:49:59.0
The challenge for 3D IC assembly is how to manage warpage and thin wafer handling in order to achieve a high assembly yield and to ensure that the final structure can pass the specified reliability requirements. Our test vehicles have micro-bumped die having pitches ranging from 60um down to 30um. The high density of pads and the large die size, make it extremely challenging to ensure that all of the micro-bump interconnects are attached to a thin Si-interposer. In addition, the low standoff between the die and interposer make it difficult to underfill. A likely approach is to first attach the die to the interposer and then the die/interposer sub-assembly to the substrate. In this scenario, the die/interposer sub-assembly is comparable to a monolithic silicon die that can be flip chip attached to the substrate. In this paper, we will discuss various assembly options and the challenges posed by each. In this investigation, we will propose the best method to do 2.5D assembly in an OSAT(Outsourced Assembly and Test) facility.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Check more detail for PCB stacker: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/97.html PCB stacker and bare board PCB loader use for automatic PCB bare board production line that can save more labor cost and without the magazin
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)
The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.
Training Courses | | | IPC-A-610 Specialist (CIS) Recert.
The Certified IPC-A-610 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-A-610 Specialists.
Events Calendar | Tue Feb 05 00:00:00 EST 2019 - Thu Feb 07 00:00:00 EST 2019 | Anaheim, California USA
ATX West - Automation Technology Expo
Career Center | Portland, Maine USA | Engineering
SKILLS: Oscopes & Multimeters; Tshoot PCB's to component level; Good understanding of Basic Electronics; 2yr degree helpful. JOB DESCRIPTION: * Test fiber optic based PCB's utilizing software scripts * Perform environmental testing, track cycle time
Career Center | Clarksburg, Maryland | Engineering
Immediate opportunities for SMT Solder Specialist. Also have these positions open. All immediate opportunities: Assembler: Must have strong electro mechanical manufacturing skills. Experience with assembly of electro mechanical products in a high
Career Center | , | 2013-01-31 04:29:34.0
• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010
Career Center | , | 2013-01-31 04:45:28.0
• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 8, (#ts#)) SMT Express, Volume 2, Issue No. 1 - from SMTnet.com Volume 2, Issue No. 1 Thursday, January 20, 2000
| https://www.wesource.com/test-and-measurement-equipment/lambda-ems-80-30-2-d-power-supply-id-700056-10/22/
Purchase From eBay Description Lambda Power Supply Model: EMS 80-30-2-D • Used equipment. This unit powers on and passes load test. • We recommend shipping this unit on a pallet via freight but UPS ground is available upon request. Asset
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc7351c-draft-or-release-date_topic1818_page2.html
IPC7351-C Draft or Release date? - PCB Libraries Forum - Page 2 Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login IPC7351-C Draft or Release date
