Malcom Reflow Profilers have been indispensable to the temperature management of reflow ovens. Smaller and lighter than previous models, new functions are also incorporated into the newest version. Models: RCP-600 Reflow Profiler RCR-60 Wireless
Large PCB manual included center board supports and J-Lead options Hardware Specifications Image Signal Input Unit * Video Camera: Triple Element CCD Camera * Light Source: 3-Ring-Shaped Fluorescent Lamps with automatic brightness control
ETA Electronic equipment CO.,LTD. to provide professional SMT automatic production line solution,The company specializes in SMT chip mounter(New samsung:SM421,SM411,SM100 etc)(second-hand： CP40L; CP40LV; CP45F; CP45FV; CP45FVneo); YAMAHA SMT mac
Industry News | 2016-07-27 20:25:41.0
Pick & place equipment manufacturer Europlacer has appointed PAKT Electronics as its exclusive distributor in Poland. Formed in 2008, PAKT is well connected across the country and represents other principals in the territory, offering capital equipment, peripherals and consumables.
AI PART 615-05-133 Koganei DA 20*25-3001W for TDK AI part for TDK: 446-1E-310 cushion spring 562-H-1430 cushion pin 556-G-1910 G main guide 556-E-1860 E sub guide(R) 556-G-1890 G sub guide L unit 556-U-1050 PIN(A) 556-U-1060 PIN(B)
AI part for TDK: 446-1E-310 cushion spring 562-H-1430 cushion pin 556-G-1910 G main guide 556-E-1860 E sub guide(R) 556-G-1890 G sub guide L unit 556-U-1050 PIN(A) 556-U-1060 PIN(B) 556-U-1070 PIN(C) 602-30-001 E Ring 446-05-006 S
Technical Library | 2019-10-16 10:20:25.0
A major goal of the development of advanced packaging technology is to reduce the size, weight, and power consumption of electronics components using state-of-the-art commercial technologies. One of the novel concepts involves the use of all three spatial dimensions when designing and producing new systems. In the past, electronic structures tended to be two dimensional in nature. Generally speaking, individually packaged integrated circuit (IC) dies were interconnected on printed circuit boards. Techniques such as die and package stacking naturally contribute to a reduction of the spatial footprint of any given electronic system design.
Technical Library | 2019-08-14 22:20:55.0
Cleanliness is a product of design, including component density, standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manufacturing process soil, such as flux residue, incompletely activated flux, incompletely cured solder masks, debris from handling and processing fixtures, and incomplete removal of cleaning fluids can hinder the functional lifetime of the product. Contaminates trapped under a component are more problematic to failure. Advanced test methods are needed to obtain "objective evidence" for removing flux residues under leadless components.Cleaning process performance is a function of cleaning capacity and defined cleanliness. Cleaning performance can be influenced by the PCB design, cleaning material, cleaning machine, reflow conditions and a wide range of process parameters.This research project is designed to study visual flux residues trapped under the bottom termination of leadless components. This paper will research a non-destructive visual method that can be used to study the cleanability of solder pastes, cleaning material effectiveness for the soil, cleaning machine effectiveness and process parameters needed to render a clean part.
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(3 Phase) Standard 480 volts 480 volts Breaker Size 100 amps @ 480v 100 amps @ 480v kW 8.5 - 10.5 Continuous* 8.5 - 10.5 Continuous* Typical Run Current 20 - 25 amps