Technical Library: 2015 (Page 1 of 16)

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Rework Challenges for Smart Phones and Tablets

Technical Library | 2015-04-23 18:48:18.0

Smart phones are complex, costly devices and therefore need to be reworked correctly the first time. In order to meet the ever-growing demand for performance, the complexity of mobile devices has increased immensely, with more than a 70% greater number of packages now found inside of them than just a few years ago. For instance, 1080P HD camera and video capabilities are now available on most high end smart phones or tablet computers, making their production more elaborate and expensive. The printed circuit boards for these devices are no longer considered disposable goods, and their bill of materials start from $150.00, with higher end smart phones going up to $238.00, and tablets well over $300.00.

Metcal

Reliable Selective Soldering For High Volume Assemblies

Technical Library | 2020-04-14 16:00:20.0

The number of through hole connections on a circuit assembly are decreasing with the drive toward miniaturization. When these assemblies are manufactured in high volumes the most convenient method is selective soldering. Although selective soldering is very well introduced in automotive and industrial applications it can also be a very efficient method to solder high volume consumer products.

ITW EAE

Electrochemical Methods to Measure the Corrosion Potential of Flux Residues

Technical Library | 2017-07-27 16:51:57.0

Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance drops on both cleaned and non-cleaned circuit assemblies. It is well documented in the literature that SIR detects ionic residue and the potential of this residue to cause leakage currents in the presence of humidity and bias. Residues under leadless components are hard to inspect for and to ensure flux residue is totally removed. The question many assemblers consider is the risk of residues that may still be present under the body of components.

KYZEN Corporation

Cleaning Flux Residue under Leadless Components using Objective Evidence to Determine Cleaning Performance

Technical Library | 2019-08-14 22:20:55.0

Cleanliness is a product of design, including component density, standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manufacturing process soil, such as flux residue, incompletely activated flux, incompletely cured solder masks, debris from handling and processing fixtures, and incomplete removal of cleaning fluids can hinder the functional lifetime of the product. Contaminates trapped under a component are more problematic to failure. Advanced test methods are needed to obtain "objective evidence" for removing flux residues under leadless components.Cleaning process performance is a function of cleaning capacity and defined cleanliness. Cleaning performance can be influenced by the PCB design, cleaning material, cleaning machine, reflow conditions and a wide range of process parameters.This research project is designed to study visual flux residues trapped under the bottom termination of leadless components. This paper will research a non-destructive visual method that can be used to study the cleanability of solder pastes, cleaning material effectiveness for the soil, cleaning machine effectiveness and process parameters needed to render a clean part.

KYZEN Corporation

PCB Laser Depanelizing Using a UV Laser

Technical Library | 2016-10-06 15:13:02.0

One of the methods gaining in popularity for singulating rigid/flex, rigid and flex circuit boards post assembly is through the use of laser routing. This method has the advantage of speed, positional accuracy, no tooling wear and lastly no induced mechanical stresses on components during the singulating process.

BEST Inc.

Adhesive Backed Plastic Stencils vs Mini Metal Stencils

Technical Library | 2015-08-27 15:32:16.0

Ever since there has been a widespread usage of surface mount parts, the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. Todays' pitches are commonly 0.5 to 0.4mm with packages of tiny outline sizes, 5 -10mm square, making the rework of such devices a challenge. In addition to the handling and inspection challenges comes the board density. Spacing to neighboring components continues to be compressed so the rework techniques should not damage neighboring components.

BEST Inc.

HCFC-225 Phaseout - What Now?

Technical Library | 2015-12-01 20:36:48.0

On January 1, 2015, nine months from APEX 2014, the production and use restrictions on HCFC-225 will be in effect throughout the United States. This phase out is encompassing in scope. This phase out will have significant technical, performance, and economic implications for the electronics industry. The regulatory situation remains fluid. A number of alternative solvents have been or are in the process of being developed. We discuss the options for assemblers and component manufacturers.

BFK Solutions LLC

Deposition of Solder Paste into High Density Cavity Assemblies

Technical Library | 2018-02-28 22:28:30.0

Circuit functional density requirements continue to drive innovative approaches to high performance packaging. Some new approaches include; aggressive space reduction, embedded solutions, and those that offer some form of risk reduction and rework potential are now options that are being explored by customers. Requirements for assembly of these types of packages necessitate the deposition of solder paste and assembly of components into cavities of the substrates to gain z-axis density as well as area functional density. Advances in the fabrication of PWB’s with cavities using newly developed laser micro-fabrication processes along with increased circuit pitch density of 50 micron lines and spaces permit new applications for high performance electronic substrates. First published at SMTA Pan Pacific Symposium

Celestica Corporation

5 Axis Fluid Dispensing

Technical Library | 2015-07-31 16:28:16.0

Technology is in constant change and circuit assembly is no different. It is becoming more and more advanced as needs change and demands for more capabilities increase. In order to meet these demands, equipment manufacturers are integrating the latest innovations and tools to serve the industry. The need to better protect printed circuit assemblies from harsh environments using automated selective conformal coating is becoming a must. 5 axis fluid dispensing allows conformal coating to be applied to printed circuit assemblies like never before.

ETS - Energy Technology Systems, Inc.

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