Industry News | 2015-07-28 16:23:06.0
ADLINK Technology will offer its first COM Express® Basic Size Type 6 module incorporating the latest Intel® Xeon® E3-1200 processor and Intel® Core™ i7 processor (formerly codenamed "Broadwell") with Intel® QM87 Chipset.
Littelfuse Inc New and Original 5KP20A in Stock IC R-6 ,21+ package 5KP20A ESD Suppressor/TVS Diode 20Vso 15VAC 154A TK13A25DS4X(S TO-220F Toshiba 15+ XC6219B152MR-G SOT153 TOREX 13+ S912ZVL96F0MLFR QFP48 NXP 22+ DS90UB935TRHBRQ1 WQFN-32
LMZM23600V3SILR 36V, 0.5A Step-Down DC/DC Power Module in 3.8mm × 3mm Package TI New and Original LMZM23600V3SILR in Stock IC 10-LDFN Exposed Pad, Module, 21+ package Today's Hot Deals： LE4271-2 TO263 INFINEON 22+ AD620ANZ DIP-8 ADI
Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale
KingFei SMT Tech | https://www.smtspare-parts.com/sale-35518965-kv8-m71s0-50x-yv100x-nozzle-shaft-kv8-m71s0-00-std-shaft-1-spare-parts.html
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GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-Doc-Package-801-1-01.pdf
about the smallest possible protrusion below the board. For shorter protrusions, use secondary cut-off dies in Stations 4 & 5. 4 & 5 1000 (254 metric) If using secondary cut-off dies, then Station 4 = A - edge and Station 5 = A + 2B - edge. 8 5 (setting
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