Product Name: solder paste rewarming machine Origin: Shenzhen Material: hot steel spraying Product size: L500 * w300 * h230 (mm) Weight: net weight 15kg, plus packing weight 20kg
Parameter name / model specification / type UL330 UL445 UL530 UL535 Supply voltagePower Supply： AC220V/50/60HZ Supply pressureAir Supply： 5kgf/c㎡ PCB size (mm)： 330*50~250 445*50~330 530*50~390 535*50~460 PCB direction: Left to right（ opetio
Electronics Forum | Mon Jun 18 08:33:25 EDT 2018 | geethu
Hi,We are in RFµwave assembler and one the customer requirement need conformal coating cover the chipcomponent metalisation solder fillet. We made as per customer requirment and ship the parts to customer. Again the customer do pick & place our compo
Electronics Forum | Mon Jun 18 14:35:40 EDT 2018 | davef
That's a reasonable question for a supplier to ask his / her customer. It depends ... It depends on the materials use in the process the assembly and the reflow temperature recipe
Industry News | 2020-06-30 15:07:32.0
MIRTEC is excited to announce its participation in an exclusive ONLINE CONFERENCE & EXPO. The event will be broadcast live on Wednesday, July 8, 2020 from 10 a.m. - 2:30 p.m. EST and will include a full program of live presentations, interviews and special guests.
Detailed Product Description Brand: DEK Part Name: Timing Belt Part Number: 107058 Condition: New Type: 6T2, 5 230 Certificate: ISO DEK265 Belt (BELT ,TIMING (6T2,5 230)) PN:107058 For DEK Printer Machine Detail Information: 1, Part Name: T
PANASONIC CM402 1001 PANASONIC CM402 1005 PANASONIC CM402 110 PANASONIC CM402 115 PANASONIC CM402 115A PANASONIC CM402 120 PANASONIC CM402 130 PANASONIC CM402 225C PANASONIC CM602 110S PANASONIC CM602 115AS PANASONIC CM602 120S PANASONIC C
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2016-11-17 14:37:41.0
With increasing LED development and production, thermal issues are becoming more and more important for LED devices, particularly true for high power LED and also for other high power devices. In order to dissipate the heat from the device efficiently, Au80Sn20 alloy is being used in the industry now. However there are a few drawbacks for Au80Sn20 process: (1) higher soldering temperature, usually higher than 320°C; (2) low process yield; (3) too expensive. In order to overcome the shortcomings of Au80Sn20 process, YINCAE Advanced Materials, LLC has invented a new solderable adhesive – TM 230. Solderable adhesives are epoxy based silver adhesives. During the die attach reflow process, the solder material on silver can solder silver together, and die with pad together. After soldering, epoxy can encapsulate the soldered interface, so that the thermal conductivity can be as high as 58 W/mk. In comparison to Au80Sn20 reflow process, the solderable adhesive has the following advantages: (1) low process temperature – reflow peak temperature of 230°C; (2) high process yield – mass reflow process instead of thermal compression bonding process; (3) low cost ownership. In this paper we are going to present the die attach process of solderable adhesive and the reliability test. After 1000 h lighting of LED, it has been found that there is almost no decay in the light intensity by using solderable adhesive – TM 230.
Training Courses | | | IPC J-STD-001 Trainer (CIT) Recert.
The Certified IPC J-STD-001 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC J-STD-001 (CIS) training.
Training Courses | ONLINE | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu May 17 00:00:00 EDT 2018 - Fri May 18 00:00:00 EDT 2018 | ,
Tin Whisker - All You Should Know - SMTA Webtorial
Career Center | Phoenix, Arizona USA | Production,Quality Control
Growing contract electronic manufacturer seeking to fill multiple positions: SMT Operator/Programmer Individual will determine and specify, revise and/or review, the most economic methods, operation sequence and tooling for the fabrication of pri
Career Center | Oldsmar, Florida USA | Maintenance,Production
Job Title: Assembler 2 – IPC 620 – 2nd Shift Address: 3655 Tampa Rd, Oldsmar FL 34677 Duration: 1 year Pay Rate: $15-$17 Hours: 9/80 schedule Monday –Thursday 3:30pm – 1:00am, Friday 2:30pm to 11:00pm Job Description: Performs a variety of tas
DEK265 Metric Timing Belt Parts 6T2 , 5 230 Type PN 107058 Leave a Message We will call you back soon! Your message must be between 20-3,000 characters