Industry News: 280mm 280mm (Page 1 of 1)

Viscom will be Introducing the X7055 at the SMT 2003

Industry News | 2003-04-10 09:31:04.0

Combined AOI/AXI now also available with 4M megapixel technology for maximum throughput

Viscom AG

Molex Introduces New CMC Standard Header and Solder-Mount Headers with Press-Fit Terminals

Industry News | 2011-12-29 17:27:04.0

Molex CMC product line has expanded with the introduction of a 154-circuit header in compliant-pin mount and 32- and 112-circuit solder-mount headers. Designed to perform in high-conductivity applications and harsh environments, CMC is an industry standard interface used in automotive and transportation powertrain applications, including ECUs (engine control units), automatic gearboxes, suspension controllers and electric parking brakes.

Molex

Submicron semi-automatic flip eutectic placement machine flip eutectic placement machine

Industry News | 2019-12-16 22:42:05.0

T1 is a multi-function placement machine, also a submicron flip eutectic placement machine, providing placement accuracy up to 5 microns, suitable for all kinds of flip chip, common chip mounting, can handle the minimum chip spacing as low as 50 microns.

Beijing Technology Company

New Yorker Electronics to distribute Gowanda Ceramic Wirewound Chip Inductor Series

Industry News | 2021-05-21 14:09:53.0

Gowanda's Space/Aero Chip Inductors provide Lower Power Consumption in High Frequency Applications

New Yorker Electronics

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