New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype: onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M
New Equipment | Solder Materials
AMTECH’s BGA solder spheres are manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages. AMTECH BGA solder spheres also exceed both the IPC and MIL standards for purity levels and size tolerances. N
Electronics Forum | Tue Apr 09 05:36:27 EDT 2002 | lhudson1
Silver in the paste is present to minimise any negative effects of silver in the pcb finish or component terminations. 2% Ag prevent silver leaching thus giving a more reliable joint.
Electronics Forum | Wed Aug 23 16:46:52 EDT 2000 | Dr. Ning-Cheng Lee
Comparing 62Sn/36Pb/2Ag with 63Sn/37Pb, addition of 2% Ag introduces two major advantages. The first advantage is grain refining, and the resultant better fatigue resistance. The second advantage is a wider processing window on Ag metallization. Pres
Industry News | 2018-08-16 20:05:44.0
Indium Corporation Research Chemist, Mary Ma, and Area Technical Manager for Eastern China, Wisdom Qu, will present their papers at the 2018 SMTA China South Technology Conference on Aug. 28 in Shenzhen, China. Their papers were voted by their peers as two of the top five “Best Papers” presented in recent years at SMTA South China and SMTA East China, earning them the opportunity to present them again at this year's show.
Industry News | 2016-02-20 20:36:54.0
Indium Corporation will feature "Power-Safe" NC-SMQ®75, the world’s first and only die-attach solder paste suitable for use in non-cleaned clip bond applications in power semiconductor die-attach applications, at SEMICON China March 15-17, 2016, in Shanghai, China.
Parts & Supplies | Assembly Accessories
FUJI NXT ribbon cable M3II 2AGKSA0025 NXT FUJI Machine Accessories Flat Cable
Parts & Supplies | Pick and Place/Feeders
NXT H24 Syringe Head Shaft 2AGTHA009104 2AGTHA0091xx NXT AA65D08 SYRINGE Nozzle Holder for H12 V12 H12s H12HS FUJI Chip Mounter AA30A05 AA30A02 AA30A00 AA65D10 Pm07rx6 Nozzle Shaft Other parts packing list: WCY0011 STAND GPJ7231 BAND GPJ7271 S
Technical Library | 2012-12-13 21:20:05.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal cycle (TC) by varying the thickness of Palladium (Pd) in Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG) surface finish. We used lead-free solder of Sn-1.2Ag-0.5Cu-Ni (LF35). We found multiple micro-voids of less than 10 µm line up within or above the intermetallic compound (IMC) layer. The number of micro-voids increased with the palladium (Pd) layer thickness. Our results revealed that the micro-void formation should be related to (Pd, Ni)Sn4 phase resulted from thick Pd layer. We propose that micro-voids may form due to either entrapping of volatile gas by (Pd, Ni)Sn4 or creeping of (Pd, Ni)Sn4.
Sales manager: Mac Xie Mobile: +8618020714662(WhatsApp) Email: at@mooreplc.com Skype: +8618020714662 Product Detail BRAND:Others MFR. PART NUMBER:CPU 314SB 314-2AG13 MANUFACTURER:VIPA DESCRIPTION:CPU Module WEIGHT:0.5kg Our Best Servic
TI New and Original SN74LVC1G97DCKR in Stock IC SC70-6 21+ package SN74LVC1G97DCKR Configurable multifunctional door TPS7A6650QDGNRQ1 MSOP8 TI 22+ ATSAMD21J17A-AU TQFP64 ATMEL 21+ OPA4376AIPWR TSSOP14 TI 17+ CH32V103C8T6 LQFP48 WCH 22+ NCV8
