Industry Directory: 2h 2h 2h 2000 (11)


Industry Directory |

Canada's eCommerce Carbide Cutting Tool Wholesaler

Guardian Telecom Inc.

Industry Directory |

Contract Manufacturer

New SMT Equipment: 2h 2h 2h 2000 (2391)

VP-2800HP-CL62-2H (2 head) and VP-2800HP-CL62-4H (4 head)

VP-2800HP-CL62-2H (2 head) and VP-2800HP-CL62-4H (4 head)

New Equipment | Pick & Place

VP-2800HP-CL62-2H 2 heads 3x Analog cameras / HD camera upgrade possible 6 slot nozzle changer Optional dispenser head 62x 8mm CL Feeder slots in 2 bays 35x 8mm push feeder on West side included Optional paste / glue dispenser module Option

SMALLSMT Wenzhou SMALL Technology co. ltd

S2-H11	I/O Power Supply Chassis

S2-H11 I/O Power Supply Chassis

New Equipment | Industrial Automation

ABB PLC / ABB DCS Series: SC510 /ABB MOD 300 Kpl-plc excitation system planning characteristics 1. Scheduling operation by programmable controller and direct phase-shifting operation, with high reliability; 2. The second record of operation, high

Cambia Automation Limited

Electronics Forum: 2h 2h 2h 2000 (17)

Re: BGA storage

Electronics Forum | Wed Jan 19 17:01:18 EST 2000 | Chad Notebaert

You can buy desicant packs and indicator cards to place back in the original or a new bag with the BGA's and re-seal using a heat sealer (Vac Seal being the best). If properly done the material will be kept below the 20% RH level. Another option woul

First piece inspection

Electronics Forum | Thu Jan 10 04:06:02 EST 2002 | wbu

Hi Ianchan, you mean you set up a line and wait 6h or 2h to go on with production ? Can�t believe that! Wolfgang

Used SMT Equipment: 2h 2h 2h 2000 (28)

Fuji AIM Pick and Place Packag

Fuji AIM Pick and Place Packag

Used SMT Equipment | Pick and Place/Feeders

Fuji AIm P&P Pacakge with 400+ Feeders, Vitronics Soltec XPM3-1030 Reflow Oven, Asys Conveyors! Make: Fuji Model: AIM Quantity: Three SW: V5.BZA Single lane Machine 1 Vintage: 2006 Heads: 4 @ H12’s, (4) Feeder Trollies Hours: 32

Lewis & Clark

Fuji AIM

Fuji AIM

Used SMT Equipment | Pick and Place/Feeders

Set of (3) Fuji AIM Pick and Place with over 400 Feeders included and (3) Spare Heads!!!!! Unit 1:   Vintage:  2006    Four Heads - H12 (4) Feeder Trollies 32K hours Unit 2: Vintage 2007 Four Heads - (2) H12 &

Lewis & Clark

Industry News: 2h 2h 2h 2000 (12)

Parts & Supplies: 2h 2h 2h 2000 (176)

Casio Smt nozzles Casio H06 H2 H32 HS1 nozzles used in pick and place machine

Casio Smt nozzles Casio H06 H2 H32 HS1 nozzles used in pick and place machine

Parts & Supplies | SMT Equipment

Smt nozzles Casio H06 H2 H32 HS1 nozzles used in pick and place machine Smt 8800 machine:HS1/HIM/H2/H2M/H06/H7/H07/H21/H22/H23/H24/H31/H32/H33/H34/H35 Smt nozzle Models: M1 7000 PICK UP NOZZLEφ1.5/φ0.45 M2 7000 PICK UPNOZZLEφ1.0/φ0.4 M7 7000 PI

KingFei SMT Tech

Casio Smt nozzles Casio H06 H2 H32 HS1 nozzles used in pick and place machine

Casio Smt nozzles Casio H06 H2 H32 HS1 nozzles used in pick and place machine

Parts & Supplies | SMT Equipment

Smt nozzles Casio H06 H2 H32 HS1 nozzles used in pick and place machine Smt 8800 machine:HS1/HIM/H2/H2M/H06/H7/H07/H21/H22/H23/H24/H31/H32/H33/H34/H35 Smt nozzle Models: M1 7000 PICK UP NOZZLEφ1.5/φ0.45 M2 7000 PICK UPNOZZLEφ1.0/φ0.4 M7 7000 PI

KingFei SMT Tech

Technical Library: 2h 2h 2h 2000 (47)

Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?

Technical Library | 2020-11-04 17:49:45.0

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.

ZESTRON Americas

Electrochemical Methods to Measure the Corrosion Potential of Flux Residues

Technical Library | 2017-07-27 16:51:57.0

Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance drops on both cleaned and non-cleaned circuit assemblies. It is well documented in the literature that SIR detects ionic residue and the potential of this residue to cause leakage currents in the presence of humidity and bias. Residues under leadless components are hard to inspect for and to ensure flux residue is totally removed. The question many assemblers consider is the risk of residues that may still be present under the body of components.

KYZEN Corporation

Videos: 2h 2h 2h 2000 (5)

Siemens Bliater unit 00367793S03


00354974-01 ACTIVATOR LED 00354976-01 Power Supply 24V DC 00354977-01 Emergency Stop Button 00354978-01 Emergency Stop Switchgear 00354979S01 Simovert Masterdrive Lifting Axis 00354980S01 Simovert Masterdrive Feed Axis 00354981-01 Optocoupler

Qinyi Electronics Co.,Ltd

Siemens 12er-Segment kpl.DLM2 00319748S03


00350533-01 COMP.Magazine long W21,5/H11,1/LE37 00350544-01 RETROFIT KIT COVER CUTTING DEVICE S23 00350588S03 Sleeve with ball fixing compl. DLM1 / 12 00350661S01 O-Ring 10*1 Viton 75 00350662S01 O-Ring 10*1 Viton 75 00350833S01 STRIP MOTOR 12-1

Qinyi Electronics Co.,Ltd

Career Center - Resumes: 2h 2h 2h 2000 (1)

Process Engineering/Maintenance Technician

Career Center | Fredericksburg, Virginia USA | Engineering,Maintenance,Management,Production,Quality Control

• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat

Express Newsletter: 2h 2h 2h 2000 (169)

SMT Express, Volume 2, Issue No. 1 - from

INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('', '#Quser_profile.username#', 9, (#ts#)) SMT Express, Volume 2, Issue No. 1 - from Volume 2, Issue No. 1 Thursday, January 20, 2000


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Partner Websites: 2h 2h 2h 2000 (27)

Universal PIN - 14077000 - QYSMT


50684332 NOZZ FJC, 2H/072C/203/176CL 50684361 NOZZ FL, 1C-125/90C-CN 50684333 NOZZ FJC, SL-040X320X255-CX 50684373 NOZZ FJ, TS-200X360X250-CX 50684334 NOZZ FL-062X460X275-CX 50684374 NOZZ FL, 2SL

Component Forming Machine Set Up

GPD Global |

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GPD Global

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Panasonic AM100

ONLINE IPC Training & Certification
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High Throughput Reflow Oven

Easily dispense fine pitch components with ±25µm positioning accuracy.
Assembly Automation Technology

Private label coffee for your company - your logo & message on each bag!