Electronics Forum | Fri Mar 03 14:40:22 EST 2006 | amol_kane
i think a more important issue here would be the reduction ratio. as LF solders have a higher surface tension, they do not flow as well as their leaded counterparts. therefore the stencil design may have to be changed (hence a new stencil) if the red
Electronics Forum | Tue Jul 09 15:20:19 EDT 2002 | pjc
When you look at the capabilities of Combo machines they tend to sacrifice performance when compared to separate X-ray and AOI machines, meaning they don't do either the X-ray or AOI operations as well as a machine that was designed to do only one. A
Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied
Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar
Electronics Forum | Wed Jul 19 12:54:04 EDT 2023 | calebcsmt
Since side fillets are not a requirement for QFNs/BTCs due to some packages not having wettable side terminations, how does one determine if the side terminations are actually solderable/designed for wetting? Is it simply if the side terminations
Electronics Forum | Fri Apr 27 08:44:08 EDT 2007 | Brett
For those of you who use via holes as test points, and the via holes must be filled at the wave, is it necessary to have a "dome" on every single test point, or is it sufficient to have the via "filled" with solder? The ICT preson here insists that
Electronics Forum | Tue Dec 04 09:48:43 EST 2001 | davef
Defining the thickness of solder between the lead and the pad, J-001 states "Properly wetted fillet shall be evident." J-001 is available from http://www.ipc.org. Factors that affect this are: * Amount and composition of solder * Amount and compo
Electronics Forum | Fri Apr 27 10:55:54 EDT 2007 | Brett
Pete, is there a probe-style that will accomodate a via that's filled, but a little concave (inward) fillet? The ICT personnel complains about this scenario too. I'm not an ICT person, but I do know that there are pogo pins that have a crown (for t
Electronics Forum | Tue Jun 09 07:35:23 EDT 1998 | Steve Gregory
Hi there Gary, Your solder ball problem is very similar the problem I experienced, but I was using a water soluble paste at the time. It started by inspectors telling me that they were seeing cold solder on some SIMM's that we had built regularly. W
Electronics Forum | Thu Jan 27 11:23:45 EST 2005 | russ
Well first off I wouldn't evaluate paste for a wave process. I would use solder bar instead. Flux - top side fillets and no shorting on the solder side, does it clean well after processing if using water soluble flux. How wide is the process win
Electronics Forum | Tue Jun 09 15:46:29 EDT 1998 | Aric Parr
| Hi there Gary, | Your solder ball problem is very similar the problem I experienced, but I was using a water soluble paste at the time. It started by inspectors telling me that they were seeing cold solder on some SIMM's that we had built regularly
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