New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype: onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M
22510 PART 22705 PART 10114KX PCB ASSEMBLY 10115BP PCB ASSEMBLY 101-4 RACK CONSOTROL FLUSH MOUNT 4UNIT MOUNTING 111-A INDICTAOR 111-A-L INDICTAOR PNEUMATIC CONSOTROL HIGH-LOW ALARM LIGHT 121003D D ETECTOR 122-FE RECORDER 2PEN PNEUMATIC PROCES
Electronics Forum | Thu Jan 10 12:11:00 EST 2002 | Bo Apostolache
Dmitry, we are a contract manufacturer in Southern California. We have the capability to manufacture the above mentioned board assembly. As a rough estimate, we would be able to assemble your board for somewhere between $6-$7, depending on quantity
Electronics Forum | Tue Nov 03 20:00:47 EST 2009 | davef
Solder Mask Adhesion Pull Test Tape List IPC-TM-650 Test Method 2.4.28.1, Adhesion, Solder Resist (Mask), Tape Test Method, defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated
Industry News | 2022-03-03 16:04:03.0
The European EMS industry grew 9 percent from 2020 to 2021 to exceed 44 billion Euros according to the annual survey results collected and analyzed by in4ma, the market research arm of Weiss Engineering. IPC has partnered with Weiss Engineering since 2020 to deliver industry intelligence to the European electronics community. The 2021 result represents an all-time high for the industry beating the 2019 result by 1 percent.
Industry News | 2016-09-15 18:27:44.0
Motorized design takes guess-work out of repositioning applicators during printed circuit board assembly and electronics manufacturing.
Technical Library | 2007-11-15 15:54:44.0
At the contractor level once a product is required to be soldered with lead-free solders all the processes must be assessed as to insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow, wave soldering and hand assembly processes must all be optimized carefully to insure good joint formation as per the appropriate class of electronics with new solder alloys and often new fluxes.
Technical Library | 2024-07-24 00:51:44.0
A blade server system (BSS) utilizes voltage regulator modules (VRMs), in the form of quad flat no-lead (QFN) devices, to provide power distribution to various components on the system board. Depending on the power requirements of the circuit, these VRMs can be mounted as single devices or banked together. In addition, the power density of the VRM can be high enough to warrant heat dissipation through the use of a heat sink. Typically, at field conditions (FCs), the BSS are powered on and off up to four times per day, with their ambient temperature cycling between 258C and 808C. This cyclical temperature gradient drives inelastic strain in the solder joints due to the coefficient of thermal expansion (CTE) mismatch between the QFN and the circuit card. In addition, the heat sink, coupled with the QFN and the circuit card, can induce additional inelastic solder joint strain, resulting in early solder joint fatigue failure. To understand the effect of the heat sink mounting, a FEM (finite element model of four QFNs mounted to a BSS circuit card was developed. The model was exercised to calculate the maximum strain energy in a critical joint due to cyclic strain, and the results were compared for a QFN with and without a heat sink. It was determined that the presence of the heat sink did contribute to higher strain energy and therefore could lead to earlier joint failure. Although the presence of the heat sink is required, careful design of the mounting should be employed to provide lateral slip, essentially decoupling the heat sink from the QFN joint strain. Details of the modeling and results, along with DIC (digital image correlation) measurements of heat sink lateral slip, are presented.
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