Technical Library: 5

Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting

Technical Library | 2015-05-28 17:34:48.0

The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.

Panasonic Factory Solutions Company of America (PFSA)

The Evolution of Surface Finishes in Mobile Phone Applications

Technical Library | 2017-02-28 12:39:50.0

During the last 5 years mobile phones and other portable consumer electronics have been extremely popular and spread all over the world in different climate zones in very high volumes. At the same time the mobile phone terminal for many people has become a necessity that is brought with them in any activity they practice. These changes in user behavior have heavily changed the impact on handheld terminals from moisture, sweat, corrosive atmospheres and mechanical drop. As a result of this the requirement to solder joint reliability, corrosion stability and wear resistance are heavily increasing to keep a high reliability of the terminal.Immersion Ni/Au has been the overall dominant surface finish on Printed Wiring Boards (PWB's) for the last 10 years, but a paradigm shift to avoid use of this thin and porous surface finish is ongoing nowadays because it can’t address these challenges in a satisfactory way.In today's handheld terminals, Organic Solder Preservative (OSP) has replaced Immersion Ni/Au on solder pads. Carbon surface finish for Key- and spring contact-pads, combined with the right concept design can make use of Immersion Ni/Au unnecessary in the near future. The result will be higher reliability with less expensive and simpler processes.This paper will discuss the various considerations for choice of surface finish and results from the feasibility studies performed.

Nokia Corporation

Intel StrataFlash™ Memory Technology Overview

Technical Library | 1999-05-07 10:11:55.0

The Intel StrataFlashTM memory technology represents a cost breakthrough for flash memory devices by enabling the storage of two bits of data in a single flash memory transistor. This paper will discuss the evolution of the two bit/cell technology from conception to production.

Intel Corporation

Privacy Threats through Ultrasonic Side Channels on Mobile Devices

Technical Library | 2017-05-11 18:03:24.0

Device tracking is a serious threat to the privacy of users, as it enables spying on their habits and activities. A recent practice embeds ultrasonic beacons in audio and tracks them using the microphone of mobile devices. In this paper, we explore the capabilities, the current prevalence and technical limitations of this new tracking technique based on three commercial tracking solutions. To this end, we develop detection approaches for ultrasonic beacons and Android applications capable of processing these.

Technical University Braunschweig

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