Electronics Forum | Mon Jul 02 20:13:41 EDT 2001 | davef
We agree with Wolfgang. Adding points along his line of reasoning: * Also consider placed component prescience. Sometimes, a mis-pick results in paste on the nozzle, which leads to the next component being stuck on the nozzle and not placed, which
Electronics Forum | Thu Dec 22 06:46:01 EST 2011 | rameshraja
Dear All, We are doing PCBA's manufacturing,Inprocess we are doing manual soldering, reflow and wave soldering process, As per ISO-7.5.2 Process validation ( Special process ) Soldering process is considered as an special process, hence in order to
Electronics Forum | Sun Sep 22 09:36:04 EDT 2002 | davef
Sometimes the cut end of QFP leads have corrosion that is very difficult to solder. If this is what you're talking about, it is not a defect according A-610C, 6.5.2, Exposed Basis Metal
Electronics Forum | Mon Mar 23 17:14:55 EDT 2009 | blnorman
That's one of the old IPC-A-610 revs. The latest, Rev D removed the size allowables and put in a general criteria statement(section 5.2.6.1).
Electronics Forum | Wed Feb 03 18:29:46 EST 2010 | mika
4.85 V - 5.2 Volts. That is on the computer power inlet, Not the on the power supply. /Best Regards
Electronics Forum | Mon Jul 15 11:36:18 EDT 2013 | rgduval
Some great legal language here, Dave. Guess some people don't like their knowledge being shared. Probably shouldn't publish it to the interwebs if that's the case.
Electronics Forum | Thu Jan 18 17:26:30 EST 2018 | davef
I'm aware of no electrical test for detecting voids and air bubbles. If someone was x-raying my boards and saw voids and air bubbles and they weren't happy about it, first thing I'd do is convince them that the boards a within standard. You know some
Electronics Forum | Tue Mar 16 20:29:27 EST 1999 | Bob Bartolotta
In Section 5.1 Flux Residues, 5.2 Particulate matter 5.3 Chlorides and Carbonates & White Residues, I am assuming that these boards have been through some type of cleaning step. Hot water, saponifier, air dryed and the pictures illustrate unacceptab
Electronics Forum | Mon Sep 20 17:46:21 EDT 1999 | Dave F
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Tue Aug 19 11:31:43 EDT 2003 | davef
JEDEC standard EIA/JEP124 Section 5.2.1 Packing Moisture-Sensitive Components has words to the effect: "...Partially or lightly evacuate the bag to reduce packaging bulk and heat seal the bag as close to the end as possible following the heat sealing
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