Industry News: 5.21 (Page 1 of 2)

IPC Honors Members at APEX 2002

Industry News |

Association Connecting Electronics Industries (IPC)

2002-01-31 09:33:43.0

Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC

Industry News | 2011-05-03 22:50:52.0

Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.

Association Connecting Electronics Industries (IPC)

IPC Inducts Two Long-Time Volunteers into Hall of Fame Ray Prasad and Lionel Fullwood Join Illustrious Rank

Industry News | 2013-02-19 18:26:34.0

In recognition of their extraordinary contributions to IPC and the electronic interconnect industry, Ray Prasad, Ray Prasad Consultancy Group and Lionel Fullwood, WKK Distribution Ltd., were honored with the IPC Raymond E. Pritchard Hall of Fame Award.

Association Connecting Electronics Industries (IPC)

Matt Kelly Joins IPC as Chief Technologist

Industry News | 2020-02-01 04:55:14.0

IPC announces the addition of Matt Kelly as the association’s chief technologist.

Association Connecting Electronics Industries (IPC)

IPC Releases New Press-Fit Standard, IPC-9797

Industry News | 2020-06-11 06:05:22.0

IPC announces the release of a new standard, IPC-9797, Press-fit Standard for Automotive Requirements and Other High-Reliability Applications. The comprehensive document covers the qualifications and acceptance requirements for press fit technology, including the high-reliability needs for automotive and other industries such as aerospace.

Association Connecting Electronics Industries (IPC)

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

Karen McConnell and Linda Woody Receive IPC Presidents Award Award Presented for their Contributions to IPC and the Electronics Industry

Industry News | 2013-03-04 16:08:13.0

IPC and the industry, Karen McConnell, Northrop Grumman, and Linda Woody, Lockheed Martin, earned IPC Presidents Awards at IPC APEX EXPO® in San Diego.

Association Connecting Electronics Industries (IPC)

Three Long-Time IPC Volunteers Receive IPC President’s Award Bhawnesh Mathur, Udo Welzel and Mark Wolfe honored for their on-going leadership in IPC and electronics industry

Industry News | 2019-02-09 20:20:00.0

In recognition of their significant contributions of time, talent and ongoing leadership in IPC and the electronics industry, long-time IPC volunteers, Bhawnesh Mathur; Mark Wolfe, John Deere Electronic Solutions; and Udo Welzel, Robert Bosch GmbH, were presented with an IPC President’s Award at IPC APEX EXPO 2019.

Association Connecting Electronics Industries (IPC)

Three Long-time IPC Volunteers Receive Dieter Bergman IPC Fellowship Award

Industry News | 2020-02-18 13:55:45.0

Three IPC volunteers who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts, were presented with Dieter Bergman Fellowship awards at IPC APEX EXPO 2020. Mike Carano, Bhanu Sood and Udo Welzel were chosen as award recipients because they embody the work ethic and spirit of the late Dieter Bergman, a pioneer and industry icon. They will bestow Dieter Bergman Memorial Scholarship awards on the university or college of their choice.

Association Connecting Electronics Industries (IPC)

Volunteers Honored for Contributions to IPC and Electronics Industry Fifty Awards Presented at IPC APEX EXPO�

Industry News | 2009-04-15 23:12:38.0

BANNOCKBURN, Ill., USA, April 1, 2009 � IPC � IPC � Association Connecting Electronics Industries� presented Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service awards at IPC APEX EXPO 2009, held March 31�April 2 in Las Vegas.

Association Connecting Electronics Industries (IPC)

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