New Equipment | Industrial Automation
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New Equipment | Industrial Automation
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Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
Electronics Forum | Tue Mar 28 08:29:04 EST 2006 | davef
Pad design - Standard IPC 20 pitch QFP Thermal pad design - Layout the thermal pad 0mm to 0.15mm larger per side (0mm to 0.30mm larger overall) than the exposed die pad on the package. �Larger than�, as opposed to the same size, is preferred. Obvio
Parts & Supplies | SMT Equipment
FUJI CP, XP, NXT/AIM, GL, QP, IP, SPARE PARTS FOR SALES. 1.XPF GGPH4240/2MGGHA005200/GGPH3104 HOOK 2.XPF GGQC3670 Belt 3.XPF H63467VALVE 4.XPF H63468 VALVE 5.XPF H63469 VALVE 6.XPF ROTARY 1pcs 6. XP REPLAY R2081T 7.XP143 BODY 1pcs 7.LAM
Parts & Supplies | SMT Equipment
Many Fuji CP6,cp7/cp8, NXT, QP2, Qp3, NXT spare parts for sales.. No. Part No. Description In-stock Qty. 1 A1037Y KSHA6X15-72W 1 A1037w KSHA6X15-47W 29 2 A1039K AMPERFILER, FS-L71 1 3 A1040Z AMPERFILER,F1RM-04 3 4 A1042A AMPERFILER, PX7-C