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Refurbished NXT-III 2xM3III (2 x H24S Head) FUJI SMT Pick and Place Machine Specification of FUJI AIMEX III SMT SMD Pick and Place Machine MC Model M3 III M6 III Applicable PCB size (LxW) 48 x 48 mm to 250 x 510 mm (dou
New Equipment | Solder Paste Mixers
Product Name: solder paste rewarming machine Origin: Shenzhen Material: hot steel spraying Product size: L500 * w300 * h230 (mm) Weight: net weight 15kg, plus packing weight 20kg
NPM CM Feida Calibration Instrument NM-EJW2A CM406 CM602 NPM FEEDER corrector Size: (L) (W) 400 mm * 500 mm * 1100 mm (H); Weight: 50 kg; Adjustment precision: ≤0.02mm; Correction accuracy: ≤0.05mm; Scope of application: 8mm-32mm; Power
New Equipment | Assembly Services
Trade name: Siemens feeder calibrator Weight: About 35kg Product size (mm): L500 * W350 * H500 Calibration mode: Electric Applicable model: Siemens D series (not applicable, X series is contactless power supply, D series is plug-in terminal) Pur
8 sets of high- speed independent rotary placement heads. >The track-type PCB board is automatically conveyed,with higher efficiency and lower labor costs. >Equipped with 8 sets of individual Gigabit Ethernet port industrial flight error photo corr
10 groups of high-speed independent rotary placement heads. >The track-type PCB board automatically conveyed,with higher efficiency and lower labor costs. >Equipped with 10 sets of individual Gigabit Ethernet port industrial flight error photo corr
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New Equipment | Solder Paste Stencils
EbyDEK printer specification： ①Automatic Fiducial Setup ②Fast Print Speed ③Networking ④Small Fiducial ⑤Speed Up ⑥Tooling Deviation Monitoring ⑦Vision Plus ⑧Windows 7 Operating System Specify ①Blue USC Alternative Park ②DUI Hardware And Time To Go
Features of Refurbished JUKI JX-350 High Efficiency SMT Placement Machine Chip: 32,000CPH chip (Laser centering/Optimum); 21,000CPH chip (Laser centering / IPC9850). ■ From 0603 to 33.5mmsquare components. ■ JUKI laser centering for high speed,
Features of Refurbished JUKI JX-350 High Efficiency SMT Placement Machine Chip: 32,000CPH chip (Laser centering/Optimum); 21,000CPH chip (Laser centering / IPC9850). ■ From 0603 to 33.5mmsquare components. ■ JUKI laser centering for high speed,
New Equipment | Solder Paste Stencils
MPM UP2000 HiE Screen Printer Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps
