Customizable 0.3-5.0mm diameter sn42bi58 lead free solder wire lead free solder wire sn42bi58 0.3-5.0mm diameter Customizable Product description: Customizable 0.3-5.0mm diameter sn42bi58 lead free solder wire INQUIRY Customizable 0.3-
Electronics Forum | Mon Nov 30 21:28:54 EST 2009 | davef
"Environment Friendly Electronics: Lead-free Technology", J Hwang, Electrochemical Publications, 2001 [0901150401], Chapter 6.2, contains a significant amount of data on 58Bi/42Sn that may help you better understand the 58Bi/42Sn solder alloy. We'r
Electronics Forum | Tue Nov 24 10:03:45 EST 2009 | andrzej
Actully none couse we glue them. Please see attached file - there are red dots marking glue placment. I understand you want to check if there is any sense in gluing components. I`ll ask one more time - Is anoyne who reworked SMDs with SAC305 where
Industry News | 2019-07-09 20:13:00.0
SHENMAO America, Inc. is pleased to announce that it will exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, August 8, 2019 at the Holiday Inn Cleveland Strongsville in Strongsville. The company will showcase its PF735-PQ10 low temperature solder paste.
Industry News | 2023-09-14 17:50:57.0
SHENMAO America, Inc. is proud to introduce its latest innovation in response to the growing demand for ultra-thin packages in the electronics industry. With the increase in package thinness, the challenge of package warpage and its impact on production yield has become more pronounced.
Technical Library | 2021-01-13 21:34:29.0
Package-on-Package (PoP) is a popular technology for fabricating chipsets of accelerated processing units. However, the coefficient of thermal expansion mismatch between Si chips and polymer substrates induces thermal warpage during the reflow process. As such, the reflow temperature and reliability of solder joints are critical aspects of PoP. Although Sne58Bi is a good candidate for low-temperature processes, its brittleness causes other reliability issues. In this study, an in-situ observation was performed on composite solders (CSs) made of ...
Technical Library | 2013-01-24 19:16:35.0
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.
