Industry News: 6010 (Page 1 of 1)

IPC Releases Revision D for IPC-6012, Qualification and Performance Specification for Rigid Printed Boards

Industry News | 2015-09-30 10:08:42.0

IPC — Association Connecting Electronics Industries® has released IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards. IPC delivers the most current specifications for rigid printed board requirements to the electronic industry. The newly updated revision D will be release in conjunction with IPC-6012DS, Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards, which addresses requirements for space and military avionics.

Association Connecting Electronics Industries (IPC)

IPC Issues Electronics Industry Warning on Printed Board Microvia Reliability for High Performance Products

Industry News | 2019-03-10 20:30:11.0

The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:

Association Connecting Electronics Industries (IPC)

IPC Releases IPC-6012EM, Medical Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards

Industry News | 2020-10-04 15:08:41.0

IPC is known for developing addendums to some of its most widely used standards for specific industry sector use, including military/aerospace, space flight, automotive and telecommunications. Now, IPC has responded to requests from the medical device segment of the electronics industry and has released IPC-6012EM,Medical Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards.

Association Connecting Electronics Industries (IPC)

New Non-Conductive Die Attach Adhesive for Image Sensors & Circuit Assembly Applications

Industry News | 2018-03-12 17:42:02.0

Engineered Material Systems is pleased to debut its DA-6010 Non-Conductive Die Attach Adhesive designed for image sensor attach or chip on board applications.

Engineered Materials Systems, Inc.

ADLINK Introduces MVP-6010/6020 Series of Expandable Fanless Embedded Computers with Four Expansion Slots

Industry News | 2017-08-16 13:53:55.0

ADLINK Technology has introduced its MVP-6010/6020 Series, a new addition to its MVP family of value-priced fanless embedded computing platforms. The MVP-6010/6020 Series, with four expansion slots, not only surpasses expectations for conventional industrial PCs, but also provides a perfect balance between features and performance in a compact size, all at an exceptionally cost effective price point.

ADLINK Technology, Inc.

Kyzen to Be Represented in Five Technical Sessions at IPC APEX EXPO 2014

Industry News | 2014-02-21 12:50:41.0

Kyzen today announced that Mike Bixenman, DBA, CTO, and David Lober will present at five separate technical sessions at IPC APEX EXPO in Las Vegas in March.

KYZEN Corporation

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