Industry News | 2015-09-30 10:08:42.0
IPC — Association Connecting Electronics Industries® has released IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards. IPC delivers the most current specifications for rigid printed board requirements to the electronic industry. The newly updated revision D will be release in conjunction with IPC-6012DS, Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards, which addresses requirements for space and military avionics.
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
Industry News | 2020-10-04 15:08:41.0
IPC is known for developing addendums to some of its most widely used standards for specific industry sector use, including military/aerospace, space flight, automotive and telecommunications. Now, IPC has responded to requests from the medical device segment of the electronics industry and has released IPC-6012EM,Medical Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2018-03-12 17:42:02.0
Engineered Material Systems is pleased to debut its DA-6010 Non-Conductive Die Attach Adhesive designed for image sensor attach or chip on board applications.
Industry News | 2017-08-16 13:53:55.0
ADLINK Technology has introduced its MVP-6010/6020 Series, a new addition to its MVP family of value-priced fanless embedded computing platforms. The MVP-6010/6020 Series, with four expansion slots, not only surpasses expectations for conventional industrial PCs, but also provides a perfect balance between features and performance in a compact size, all at an exceptionally cost effective price point.
Industry News | 2014-02-21 12:50:41.0
Kyzen today announced that Mike Bixenman, DBA, CTO, and David Lober will present at five separate technical sessions at IPC APEX EXPO in Las Vegas in March.
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