Industry Directory | Manufacturer
AIM is a leading global manufacturer of solder assembly materials for the electronics industry.
Industry Directory | Manufacturer
Global soldering materials manufacturer founded in 1980 headquartered in IL. U.S.A. Products include: RoHS lead free solders + leaded, Metals Recycling Program, Solder Check Up Program, Technical Support. ISO 9001:2015 Certified
New Equipment | Solder Materials
SAC305 is a lead-free alloy that contains 96.5 % tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as compared t
AIM Lead Free Bar Solder SAC305 - sold in a package that includes 25 individual 1 lb bars of solder. Sorry we can not break a pack of 25 and only sold in multiples of 25 lbs. AIM solders, AIM lead free bar solder, AIM no clean solder paste, AIM wire
Electronics Forum | Tue Nov 15 22:27:21 EST 2011 | Jacki
Hi Zaza Thanks. Again, very appreciate if you advise me where I can get the SN100C solder bar that is water soluable. Now I'm checking Nihon Superior(Singapore) whether they have or not. As our customer's preference, we have to use the watersoluab
Electronics Forum | Wed Nov 16 12:54:00 EST 2011 | Shean Dalton
Jacki, your original post was regards to wave solder bath. With solder bar, there is no flux and you do not need to look for WS Sn100C. Sn100C is only a metal alloy. Regards, Shean
Industry News | 2018-10-17 20:06:14.0
Nathan Trotter announces that it was awarded a 2018 Global Technology Award in the category of Solder Bar for its SAC 305 Solder Bar. The award was presented to the company during a Tuesday, Oct. 16, 2018 ceremony that took place during SMTA International.
Industry News | 2018-11-16 19:02:38.0
Nathan Trotter announces that it was awarded a 2018 Mexico Technology Award in the category of Solder Bar for its SAC 305 Solder Bar. The award was presented to the company during a Wednesday, Nov. 14, 2018 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2010-04-29 21:40:37.0
The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.
ALPHA® Preforms with solder paste adds solder volume.
SN100C P810 D4????????? ???????????? ??????????????????????????????????? ?????????????? ???http://www.nihonsuperior.co.jp/
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMTnet Express, April 13, 2017, Subscribers: 30,391, Companies: 10,572, Users: 23,128 A Study to Determine the Impact of Solder Powder Mesh Size and Stencil Technology Advancement on Deposition Volume when Printing Solder Paste Karl Seelig, Tim O
SMTnet Express, Septemeber 1, 2016, Subscribers: 26,288, Companies: 14,937, Users: 41,025 Reliability Study of Low Silver Alloy Solder Pastes Jennifer Nguyen, David Geiger and Murad Kurwa; Flex (Flextronics International) Sn3.0Ag0.5Cu (SAC305
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
solder ball attach for BGA) on TIMs voiding. Fig. 8 below shows an x-ray result after sTIM reflow, then after subsequent SAC reflow (details later). Fig. 8: Reflow#1 vs. Reflow#2 – same part In the case of Heller Industries, the task was to establish the
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf
