Electronics Forum | Fri Sep 25 00:39:31 EDT 2015 | jana
Does anyone use bonding with ACF( anisotropic conductive film)?
Electronics Forum | Thu Dec 29 10:47:05 EST 2005 | Chris
The paper Dave posted the link for is great. I have to go back and read it in depth. I can build prototypes by wirebonding to ENIG. I can do it on a manual wirebonder but I don't have the patience to do it on a magazine to magazine automatic machi
Electronics Forum | Fri Mar 05 04:39:38 EST 1999 | Pan Tian Shun
I need advise on how can bonding of ICs to flex foil be done. The pitch of bonding is between 70 to 100 microns and the foil thickness is from 25 to 35 microns. Anyone, please enlighted what kind of bonding technology (thermo-sonic maybe), and curre
Electronics Forum | Sat Mar 06 08:45:16 EST 1999 | Dave F
| I need advise on how can bonding of ICs to flex foil be done. | The pitch of bonding is between 70 to 100 microns and the foil thickness is from 25 to 35 microns. | | Anyone, please enlighted what kind of bonding technology (thermo-sonic maybe), a
Electronics Forum | Wed Sep 25 15:58:36 EDT 2002 | bschreiber
Hello Dave, I hope that electronic slap didn�t hurt too much. Robf, I am sorry that you did not agree with my initial response, but the answer is very detailed and most of the support material I have is only in paper format so I need to either snai
Electronics Forum | Mon Jul 22 05:01:42 EDT 2002 | Comrade
Can anybody highlight the risks of implementing ACF bonding other than it is expensive and difficult to perform ??
Electronics Forum | Mon Jul 22 08:27:51 EDT 2002 | davef
Look here; http://www.unitekeaprosystems.com/res_tech/pdf/HDHBCWAB.pdf ACF Bonding. Anisotropic Conductive Film / Anisotropic Conductive Foil Bonding.
Electronics Forum | Sun Dec 23 08:41:04 EST 2001 | dwoon
Does anyone has experience in ACF (anisotropic conductive film) process? What is the typical bonding pressure/force/temperature for FCOG (flip chip on glass)? Will the glass crack when a high pressure applied during flip chip placement? Thanks and
Electronics Forum | Tue Mar 03 09:37:54 EST 2015 | capse
Hot bar soldering or hot bar bonding with ACF is widely used for your applications. A company I represent can assist you; Fancort Industries.
Electronics Forum | Wed Jun 24 21:32:07 EDT 1998 | Jon Medernach
Sorry Earl but as Superboy's dad I believe that makes me Superman as we did not remove him from the wreckage of a spacecraft. There is quite a bit involved in the FC process. The Kyushu Matsushita Electric Research Labs has been developing Flip Chi
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