| http://etasmt.com/te_news_industry/2021-09-01/24361.chtml
. The key aspects that lead to an effective SMT reflow soldering process are as follows: Suitable machine Acceptable reflow profile PCB/component footprint Design Carefully printed PCB using well designed stencil Repeatable placement of surface mount components Good quality PCB
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/land-patterns-for-leadfree-componet-soldering_topic612_post2167.html
. When the PCB goes through the reflow oven, the paste mask melts and moves toward the component lead. The solder in the pad corners disappears
