Industry Directory | Manufacturer
OMG is the manufacturer of the Microbond line of solder pastes, fluxes and solder spheres.
Industry Directory | Consultant / Service Provider / Manufacturer
Interflux USA, Inc. Mfg. and Distribution of high quality solders, fluxes and solder paste. Specialized in No-Residue soldering.
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Cleaning Agents
AQUANOX® A8820D is a pour and go, engineered micro-cell cleaning fluid designed to remove wet solder paste and uncured adhesive from stencils used with the surface mount printing process. No Mixing or Monitoring For Spray-in-Air & Select Ultrason
Electronics Forum | Tue Sep 12 07:59:03 EDT 2000 | Kevin Hussey
I suggest not to. You are also adding the flux of the paste that may cause you trouble in the long run. I suggest setting up a reclaim process with you paste vendor, or someone they reccomend.
Electronics Forum | Mon Mar 25 21:45:22 EDT 2024 | buckeye
I got an inquiry from one of our electronics labs with regards to their soldering processes. They use eutectic (63% Sn, 37% Pb) solder. For liquid flux they are currently using Kester 186, which is an old-school, full rosin (RMA and ROL1) flux that c
Used SMT Equipment | Soldering - Wave
this type can be added with nitrogen protection system 1 Flux spraying system 1.1 Spray fluxer can sense the board size automatically, and the spraying area can be adjusted according to the width of PCB. 1.2 Spray fluxer can sense the conveyor
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Parts & Supplies | Soldering - Reflow
Manufacturer: Rehm Typer: V8 Nitro 3.8 Vintage: 2002 Serial number: 1009 Condition and equipment We have this unit as backup machine, haven't used for a while. 7 zones (5 pre-heat, 2 peak + cooling zone) Transport rail refurbish
Technical Library | 2018-03-15 07:23:35.0
The SMT assembly process is continuously challenged by the factors which enhance circuit board performance and limit productivity. The pick and place and reflow systems reflect these driven issues by adding more and more controls to their systems, but the fact is one of the age old processes continues to operate within the same rules since the dawn of the SMT assembly world: The SMT screen printing. (...)This paper showcases a new stencil process that was discovered by reverting to the basics:understanding the reason for each stencil material process, focusing on detailed finishes and a disciplined aperture design process, maintaining original designs, and making the correctly designed apertures to control the paste deposition. The test results drove us to focus the efforts on the aperture walls In this paper we will demonstrate with lab tests SMT process results howthe improved paste release results in improved SMT print process performance and its positive impact on SPI yields and EOL performance.
Technical Library | 2019-08-14 22:20:55.0
Cleanliness is a product of design, including component density, standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manufacturing process soil, such as flux residue, incompletely activated flux, incompletely cured solder masks, debris from handling and processing fixtures, and incomplete removal of cleaning fluids can hinder the functional lifetime of the product. Contaminates trapped under a component are more problematic to failure. Advanced test methods are needed to obtain "objective evidence" for removing flux residues under leadless components.Cleaning process performance is a function of cleaning capacity and defined cleanliness. Cleaning performance can be influenced by the PCB design, cleaning material, cleaning machine, reflow conditions and a wide range of process parameters.This research project is designed to study visual flux residues trapped under the bottom termination of leadless components. This paper will research a non-destructive visual method that can be used to study the cleanability of solder pastes, cleaning material effectiveness for the soil, cleaning machine effectiveness and process parameters needed to render a clean part.
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method. More on the StencilQuik(TM) process here:
Adding ALPHA® solder preforms to solder paste can result in complete hole fill in electronic assembly pin in through hole soldering applications. www.alpha.alent/products/preforms
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
GPD Global | https://www.gpd-global.com/lead-free-solder-paste-dispensing.php
% to be exact. Solder Paste Dispensing: Leaded vs. Lead Free Solder paste is a mixture of solder spheres and flux formulated for dispensing
| https://pcbasupplies.com/lead-free-solder-paste/
$ 49.23 Add to cart JM-20 Sn60/Pb40 – 0.8 mm No Clean Leaded Flux Cored Solder Wire $ 93.85 Add to cart More Solder Paste Products StripFeeder 1-1/4
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