Industry Directory: adhesive and deposit (3)

CiXi Tian Hao Electric Technic Co.,LTD

Industry Directory |

TianHao company offer a full range of fluid dispensing equipment and consumable that provide the quality results you demand. and Complete robotic dispensing solutions and high precision systems.

SIPAD Systems Inc.

Industry Directory | Manufacturer

The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.

New SMT Equipment: adhesive and deposit (38)

SIPAD boards delivered with solid solder and adhesive flux protected by release paper

SIPAD boards delivered with solid solder and adhesive flux protected by release paper

New Equipment | Materials

SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards are t

SIPAD Systems Inc.

Epoxy and Adhesive

Epoxy and Adhesive

New Equipment | Dispensing

For Die attach / Die bonding / Potting / Casting / Encapsulating / etc.

K-Net International Ltd.,Part

Electronics Forum: adhesive and deposit (193)

Graphite/Carbon deposit on PWB ( any Industrial Specs?)

Electronics Forum | Wed Mar 11 17:51:22 EDT 2009 | GSx

Thank you so much Dave, by having different lots of PCB received (same Supllier) with suspected and good carbon ink deposit, I found useful to adopt a comparison test among the different lots by usingthe IPC-TM-650 2.4.1 Adhesion , Tape Testing (lik

Graphite/Carbon deposit on PWB ( any Industrial Specs?)

Electronics Forum | Thu Feb 26 15:49:48 EST 2009 | GSx

Hi I am looking for informations/specs about graphite/carbon deposited on PWB as a "spring contcat" or land (? not sure how to say in English). - Are there any Standards (IPC?)who define correct thickness of graphite ? - Are there any Test Method

Used SMT Equipment: adhesive and deposit (10)

Panasonic NPM W2 pick and place machine

Panasonic NPM W2 pick and place machine

Used SMT Equipment | Pick and Place/Feeders

FEATURES ▶Higher productivity and quality with printing, placement and inspection process integration▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm▶Higher area productivity through dual

Qinyi Electronics Co.,Ltd

Industry News: adhesive and deposit (450)

GPD Global's PCD Technology Is Proven Compatible with Silver-filled Electrical and Thermal Epoxies

Industry News | 2010-12-07 14:53:07.0

GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.

GPD Global

PCB Cleaner Removes Residues on the Road

Industry News | 2003-04-30 08:51:08.0

Electrolube played the role of environmental champion in Australia recently.

SMTnet

Parts & Supplies: adhesive and deposit (90)

Juki Smt Juki_700-2000series_8x4mm_FF-style used in pick and place machine

Juki Smt Juki_700-2000series_8x4mm_FF-style used in pick and place machine

Parts & Supplies | SMT Equipment

Smt Juki_700-2000series_8x4mm_FF-style used in pick and place machine JUKI SMT Mounter feeder / feeder / feeding gun / Feeder / Stick Feeder / Stack Stick Feeder: Part Number Description E3003706AB0 AF12FS JUKI FEEDER 40081758 CF03HPR 8mm TAPE F

KingFei SMT Tech

Juki Smt JUKI-feeder-NF8mm used in pick and place machine

Juki Smt JUKI-feeder-NF8mm used in pick and place machine

Parts & Supplies | Pick and Place/Feeders

Smt JUKI-feeder-NF8mm used in pick and place machine JUKI SMT Mounter feeder / feeder / feeding gun / Feeder / Stick Feeder / Stack Stick Feeder: Part Number Description E3003706AB0 AF12FS JUKI FEEDER 40081758 CF03HPR 8mm TAPE FEEDER UNIT FOR 06

KingFei SMT Tech

Technical Library: adhesive and deposit (37)

On Oreology, the fracture and flow of "milk's favorite cookie® "

Technical Library | 2024-08-29 18:30:46.0

The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study

1st Place Machinery Inc.

Process Engineering - Why is preparation of adhesive bonding and potting materials necessary?

Technical Library | 2020-02-14 14:43:21.0

To meet the steady increase in technical requirements for electronic components, potting media properties must be extremely precise. Rheology, viscosity, filler content and curing behavior are only a few of the factors that play a role in their practical use. However, the growing complexity of materials often negatively impacts the ability to process or dispense them. In this case, material preparation and feeding systems specially designed for this purpose are required. These systems optimally prepare the material for the actual application and ensure homogeneous feeding to the dispensing system.

Scheugenpflug Inc.

Videos: adhesive and deposit (48)

Dam and Fill with dual valves. Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity.

Dam and Fill with dual valves. Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity.

Videos

Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity. http://www.nordsonasymtek.com

ASYMTEK Products | Nordson Electronics Solutions

JUKI SMD Pick and Place Machine

JUKI SMD Pick and Place Machine

Videos

JUKI RX-6R SMD Pick and Place Machine​ ❙ Introduce of JUKI RX-6R  High Speed Compact Modular pick and place machine,  JUKI RX-6R SMT placement, JUKI PCB Chip Shooter, Speed and Flexibility for High Quality Production of any PC

Dongguan Intercontinental Technology Co., Ltd.

Training Courses: adhesive and deposit (1)

IPC-A-600 Acceptability of Printed Boards Training and Certification Program

Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)

The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.

PIEK International Education Centre

Events Calendar: adhesive and deposit (4)

Stencil Printing Process and Solder Paste Inspection – An In-Depth Look - SMTA Webtorial

Events Calendar | Wed Apr 18 00:00:00 EDT 2018 - Thu Apr 19 00:00:00 EDT 2018 | ,

Stencil Printing Process and Solder Paste Inspection – An In-Depth Look - SMTA Webtorial

Surface Mount Technology Association (SMTA)

SMT Process Fundamentals for Tin-Lead and Lead Free Assembly - SMTA Webtorial

Events Calendar | Thu Jun 14 00:00:00 EDT 2018 - Fri Jun 15 00:00:00 EDT 2018 | ,

SMT Process Fundamentals for Tin-Lead and Lead Free Assembly - SMTA Webtorial

Surface Mount Technology Association (SMTA)

Career Center - Jobs: adhesive and deposit (2)

Process Engineer and Technician

Career Center | , | 2001-05-16 15:58:28.0

Fast growing, well funded, manufacturer with leading edge technology seeks process development engineer or technician. Must have experience developing processes for new products. - adhesive dispensing - reflow - profiling - screen print - cleaning

Microelectronic Assembly Technician - Colorado

Career Center | Boulder, Colorado USA | Engineering,Production,Quality Control

Senior-level micro-electronic technician capable of independent manufacture of custom hybrids, focal plane assemblies, and prototype detector assemblies in cleanroom environment (in Advanced Packaging and Detector Laboratory). MINIMUM QUALIFICATIONS

Ball Aerospace & Technologies Corp.

Express Newsletter: adhesive and deposit (351)

Partner Websites: adhesive and deposit (26353)

Conductive Adhesive & Non-Conductive Adhesive Dispensing

GPD Global | https://www.gpd-global.com/fluid-dispense-adhesive-application.php

Contacts Technical Support About Company Profile News Events Awards Employment » Applications » Adhesive Conductive Adhesive & Non-Conductive Adhesive Conductive Adhesive is an electrically conductive material that adheres dies and other small components to substrates

GPD Global


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