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Cold Ball Pull Test Efficiency for the PCB Pad Cratering Validation with the Ultra Low Loss Dielectric Material

Technical Library | 2019-05-08 21:52:28.0

Cold ball pull testing is used to validate the resistance of PCB pad cratering for the different ultra-low loss dielectrics materials (Dk=3~4.2 and Df

iNEMI (International Electronics Manufacturing Initiative)

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