The ZX-680S is a high speed auto-insertion machine for roll form metal terminals and tabs. With up to three different insertion heads, it is a combination of speed and efficiency for your terminal assembly needs. Can be equipped with optional force m
From the most feature packed entry level system to the ultimate in high volume and high capacity, the Series 600 and Series 1000 reflow ovens offer the widest choice available today. All reflow systems are Windows 7 based computer controlled for up t
Electronics Forum | Wed May 10 00:46:32 EDT 2006 | Chris
I agree! I am using a SAC305 no clean from Alpha. I have noticed that even hand probing with volt meter leads requires me to press very hard on the pads to bust through the flux residue.
Electronics Forum | Tue May 09 14:49:57 EDT 2006 | Larry
Hey guys, Anybody having trouble with increased false contact issues in ICT after switching from lead to lead free? Our test guys keep trying to imply that the flux residues are a problem (we're using Alpha EF2202), but as the soldering process eng
Industry News | 2019-08-04 20:30:07.0
IPC's Validation Services Program has awarded and renewed an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) to ALPHA-electronik A/S, an ISO9001 and ISO13485 certified EMS-based company in Denmark. Following an IPC audit, Alpha-electronics became the first European company to successfully renew and complete an intensive audit, based on two of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies.
Industry News | 2022-02-07 17:16:04.0
IPC presented its highest corporate honors to two IPC member companies, Apple Inc., and MacDermid Alpha Electronic Solutions during the IPC Annual Meeting/Awards Ceremony at IPC APEX EXPO 2022. The Peter Sarmanian Corporate Recognition Award was presented to MacDermid Alpha Electronics Solutions, and the Stan Plzak Corporate Recognition Award was presented to Apple, Inc.
Technical Library | 2017-01-05 16:55:11.0
The July 2006 implementation of ROHS exempted automotive applications from converting to lead free technology. Nine years later, all major OEM and Tier 1 automotive manufacturers have converted or are in the process of converting to lead free circuit assembly processing. Starting with SAC (SnAgCu) alloys as a baseline for lead free soldering, in the last years several specific alloys were developed in order to improve resistance to high temperature creep, vibration survival and the ability to withstand thermal cycling and thermal shock.The paper compares three different solder alloys and two flux chemistries in terms of void formation and mechanical / thermal fatigue properties. Void content and reliability data of the alloys will be presented and discussed in relation to the acceptance criteria of a Tier 1 /OEM automotive supplier. As a result, a ranking list will be presented considering the combined performance of the alloys. In order to analyze the void formation and mechanical behavior of different solder alloys and flux chemistry combinations, statistical methods are used.
Technical Library | 2017-07-13 16:16:27.0
Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles, subject to a direct current (D.C.) bias voltage are recognized by a number of global standards organizations as the preferred method to determine if no clean solder paste and wave soldering flux residues are suitable for reliable electronic assemblies. The IPC, Japanese Industry Standard (JIS), Deutsches Institut fur Normung (DIN) and International Electrical Commission (IEC) all have industry reviewed standards using similar variations of this measurement. (...) This study will compare the results from testing two solder pastes using the IPC-J-STD-004B, IPC TM-650 2.6.3.7 surface insulation resistance test, and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.
ALPHA® Preforms with solder paste adds solder volume.
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