Industry Directory | Manufacturer
A materials supplier to the electronics industry. Our breadth of products includes Solder Paste, Solder Preforms, Stencils, Liquid Soldering Flux, Soldering Alloys, Cored Wire, Adhesives, Cleaners and Sinter Technologies
The mission of Unipress is to use high pressure methods for advanced fundamental research and technology development. The main fields: Solid state physics, Optoelectronics, Sintering of nanocrystalline materials...
New Equipment | Rework & Repair Equipment
Orange Sticks with double beveled ends, 7" x 5/32" (SH-83) The Beau Tech orange sticks are made of high quality non-resin wood which will not contaminate solder and component leads. Natural wood is among the best material that does not gen
New Equipment | Rework & Repair Equipment
Angled Flat Reamer Miniature (left) & Standard (right) Tools with the Miniature Angled Flat Reamer: SH-20D Tools with the Standard Angled Flat Reamer: SH-20B Applications 30 degree bend at the tip allows access to more difficult areas. Us
Electronics Forum | Thu Dec 21 21:37:19 EST 2006 | Jack
Hi Pavel, Real Chunks, Thanks for your valuable inputs..Selecting the correct location for board profiling is critical in determining the solder joint quality. Am I right to say TC wire attachment locations priority should be as below: (1) Thermal
Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef
Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly
Used SMT Equipment | X-Ray Inspection
Yestech High Resolution Imaging PCB Xray Serial Number: X10706656 Model Number: YTX 3000 Year 2007-2008 130 KV XrayTube with 5 micron spot size Xray on Hours - 18.2 Standby Hours - 328.5 Measured Filament - 2.22 Hamamatsu L19181-02 Sample Ma
Used SMT Equipment | X-Ray Inspection
Yestech High Resolution Imaging PCB Xray Serial Number: X10706656 Model Number: YTX 3000 Year 2007-2008 130 KV XrayTube with 5 micron spot size Xray on Hours - 18.2 Standby Hours - 328.5 Measured Filament - 2.22 Hamamatsu L19181-02 Sam
Industry News | 2019-10-16 14:45:19.0
MIRTEC announces that the company will premier its all-new ALPHA 3D Automated Optical Inspection System at productronica 2019. New to this event, Messe München and Konradin Verlag have organized a 3D AOI Arena in Hall A2. Leading 3D AOI manufacturers such as MIRTEC will demonstrate their latest 3D Inspection Technology at this four-day event scheduled to take place Nov. 12-15, 2019, at the Munich Trade Fair Center in Munich, Germany.
Industry News | 2020-01-06 16:06:59.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1900 at the 2020 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 4-6, 2020 at the San Diego Convention Center.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
To see more about the Jade MKII Single Point Selective Soldering System visit Pillarhouse USA at: https://www.pillarhouse.co.uk/products/selective-soldering-handload/jade-mkii-handload Entry-level, single point selective soldering system Designed t
Training Courses | | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Training Courses | | | IPC J-STD-001 Space Specialist (CIS)
The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.
Events Calendar | Mon Jan 14 00:00:00 EST 2019 - Mon Jan 14 00:00:00 EST 2019 | ,
Webinar: Crimp Inspection, Quality Control in the Real World of Manufacture
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Career Center | South Plainfield, New Jersey USA | Engineering
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | Orlando, Florida USA | Production
Position Summary: Build through-hole (THT) and surface mount (SMT) printed circuit board assemblies, placing components on boards per controlled parts lists, drawing documentation and quality workmanship guidelines. Position reports to: Group Lea
Career Center | seoul, South Korea | Engineering
I have 4 year process engineering in Motorola and 7 years service experience in Assemblen . 2 years in Mirtec AOI as service manager .
Career Center | Poplar Grove, Illinois | Engineering,Production,Quality Control,Technical Support
Please see resume.
assemblies for high reliability applications ar
on volume delivery and positioning accuracy for solder p
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/efd-products/solderplus-solder-paste
dispense paste is the solution. As a global leader in dispensing solutions, Nordson EFD has developed a family of high-quality solder pastes specifically formulated for dispensing applications
| https://www.eptac.com/blog/increase-quality-efficiency-profits-with-solder-training-ipc-certification
consistent, high-quality product. Becoming IPC certified in one or multiple levels of electronic and cable wire harness... Read More Blog How to Safeguard Against Counterfeit Components As technological advancements with production and materials keep making major leaps forward, the business of counterfeit parts also
