Industry Directory | Manufacturer
Rommtech-3S is your partner for reliable and cost effective contract manufacturing!have more than 15 years experience in the production of electronic and electromechanical devices � security products, radiators; cash registers manufacturing; igniters
New Equipment | Solder Paste Stencils
ALPHA® Stencil products are based on unique blends of advanced technology, the experience gained from having made over half a million solder paste stencils, the specialist knowledge that could only be accumulated by a company privileged to produce bo
Electronics Forum | Sun Apr 05 07:00:31 EDT 2015 | vitrost
After washing a tetra bond stencil at PBT machine (Vigon SC200, 50 deg Celsius by 20 minutes) some signs of glue degradation were seen. Does anybody have an experience washing tetra bond in Vigon? What temperature regime is preferable? Thanks
Electronics Forum | Fri Apr 10 12:23:27 EDT 2015 | utosun
The recommended wash concentration for stencil cleaning with VIGON SC200 is 25% and this should be confirmed using the ZESTRON BA-20 bath analysis kit. Additional cleaning recommendations are: Wash temperature should be approximately 25 degrees C. /
Industry News | 2021-12-17 16:40:06.0
MacDermid Alpha Electronics Solutions will exhibit its total process solutions for the emerging semiconductor market at the Semicon Taiwan, Taipei City, December 28-30, 2021 at Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1).
External dimensions: F584: 584x584mm F584L: 736x736mm Inner dimensions: F584: 508x508mm F584L: 508x508mm Frame mechanism: anodized aluminum whole frame (not welded from 4 parts) with the possibility of compression-extension of the spri
ALPHA® TETRABOND™ is the culmination of "frameless" stencil development; an elegantly simple system designed to enhance the rigidity of the foil, making safe mounting and demounting an easier proposition. Innovatively encompassed in a thin, one piece
SMTnet Express, December 11, 2014, Subscribers: 23,586, Members: Companies: 14,135 , Users: 37,386 Failure Modes in Wire bonded and Flip Chip Packages Hikmat Chammas - Peregrine Semiconductor The growth of portable and wireless products is driving
Anisotropic Conductive Adhesive Bonding - A high-quality Interconnection Technique Anisotropic Conductive Adhesive Bonding - A high-quality Interconnection Technique Anisotropic Conductive Adhesive Bonding is an interconnection technique mostly
