Technical Library | 2008-10-01 14:02:27.0
This paper proposes an integrated system for film application process than consists of closed loop mass calibration to assure film thickness, a noncontact fast jetting process with high edge definition capable of applying films for highly selective areas and patterns. A system to obtain homogeneity of the solid-fluid mix is described and results are shared.
Technical Library | 2019-10-07 10:56:06.0
Power interfaces are required when external power sources like solar panels, fuel cells, or batteries are used to generate power for electrical devices. There are two major power interfaces commonly used, direct current to direct current (DC/DC) converters and direct current to alternating current (DC/AC) inverters. While both interfaces are designed to convert from variable DC inputs, they output to different power standards and power levels that are used in different applications.
Technical Library | 2020-02-26 23:24:02.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-inpackage (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Technical Library | 2021-06-15 15:17:33.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-in-package (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Technical Library | 2017-12-07 10:35:50.0
Electronics manufacturers protect their circuit boards with conformal coatings. Conformal coatings serve as a barrier from environmental hazards and internal shorts, tin whiskers, and corrosion at the board level. Within conformal coatings different material chemistries specialize in shielding from an array of hazards and can be applied by multiple methods. The most common method is atomized spray which disperses the material into a fine mist. Alternatively, non-atomized coating controls the materials' dispense shape while maintaining the original liquid form. While some applications demand atomized spray and other scenarios overlap between atomized and non-atomized coating, this paper focuses on the circumstances where materials are ideally suited for non-atomized, selective coating.
Technical Library | 2010-08-26 20:43:08.0
Radio frequency identification (RFID) ICs are a popular alternative to barcodes for PCB tracking applications. This article outlines some of the challenges that may be encountered when implementing an RFID system
Technical Library | 2010-11-04 19:56:25.0
Conductive Adhesives represent an intrinsically clean, simple and logical solution for a myriad of electrical interconnect challenges. Adhesives not only provide a "lead-free", "no clean" alternative to solder, these highly compatible materials offer viab
Technical Library | 2016-09-01 16:21:11.0
Sn3.0Ag0.5Cu (SAC305) is currently the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years, the price of silver has dramatically increased driving a desire for lower silver alloy alternatives. As a result, there is a significant increase in the number of alternative low/no silver lead-free solder alloys available in the industry recently. Our previous study showed that many alternative low silver solder paste materials had good printing and wetting performance as compared to SAC305 solder pastes. However, there is lack of information on the reliability of alternative alloy solder joints assembled using alternative low silver alloy solder pastes.In this paper, we will present the reliability study of lead-free solder joints reflowed using various lead-free alloy solder pastes after thermal cycling test (3000 cycles, 0°C to 100°C). Six different lead-free pastes were investigated. SAC305 solder joints were used as the control. Low and no silver solder pastes and a low temperature SnBiAg solder pastes were also included.
Technical Library | 2011-08-25 17:47:23.0
While SnAgCu (SAC) alloys still dominate Pb-free selection in North America, especially Sn3.0Ag0.5Cu (SAC305), there are alternative material systems available. Any OEM that is concerned about the high reflow temperatures of SAC or relies on ODM, it is im
Technical Library | 2021-04-01 14:40:08.0
We demonstrate the viability of using ultra-thin sheets of microbially grown nanocellulose to build functional medical sensors. Microbially grown nanocellulose is an interesting alternative to plastics, as it is hydrophilic, biocompatible, porous, and hydrogen bonding, thereby allowing the potential development of new application routes. Exploiting
