Industry News | 2017-08-02 07:12:18.0
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:
Industry News | 2019-11-05 22:10:56.0
Many customers and electronic designers were asking questions about the aluminum-based board, today our chief technical official Luca Zhang shared the knowledge and experience to you.
Industry News | 2013-10-31 11:53:09.0
Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.
Industry News | 2015-08-11 09:37:25.0
Saline Lectronics now offers wire bonding in-house as an added-value service. With the installation of the Kulicke & Soffa 4500 Manual Wedge Bonder, Saline Lectronics is now one of the only electronic contract manufacturers in the Midwest to support wire bonding services.
Industry News | 2012-05-11 20:19:04.0
Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications" during IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging, taking place at the Dearborn Hotel in Dearborn, Michigan May 22-24, 2012.
Industry News | 2013-05-06 18:13:00.0
Hesse Mechatronics will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder at the company’s west coast demonstration and applications lab, located at long-time company manufacturer's representative Chalman Technologies in Anaheim, California.
Industry News | 2010-02-19 09:45:37.0
Pressurex® Sensor Film Needed to Measure Contact Pressure In Ultrasonic Welding
Industry News | 2010-09-26 15:48:56.0
Christopher Associates/Beijing Tonsan Adhesive Co. Ltd. announces that Jasbir Bath will present a paper titled “An Evaluation of Sealants used in Photovoltaic (PV) Module Manufacture” at the upcoming AIMS/Harsh Environments Symposium at the SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2016-05-21 08:04:11.0
Oak-Mitsui are proud to announce an expanded strategic partnership adding Oak Mitsui’s proprietary ABC (aluminum bonded copper) to Insulectro’s premier product portfolio including CAC (copper aluminum copper). By leveraging their bicoastal manufacturing locations, ABC will continue to manufacture its bonded product in Hoosick Falls, NY and Insulectro will continue to manufacture CAC at its facility in Lake Forest, CA. The complete line of Oak-Mitsui copper foils, on CAC and ABC, will be available in Insulectro’s inventory by June 17, 2016.
Industry News | 2015-12-28 17:22:37.0
Nihon Superior will exhibit in East Hall 1 E3-18 at NEPCON Japan, scheduled to take place Jan. 13-15, 2016 at the Tokyo Big Site in Japan. The reliability of SN100C has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.
