Industry Directory: anys (464)

XDry

XDry

Industry Directory | Manufacturer of Assembly Equipment

XDry is the leading designer and manufacturer of desiccant dry cabinets offering controlled humidity storage solutions. We also sell replacement parts for our competitor's products like Totech, Superdry, AutoDry worldwide.

WPI Vision

WPI Vision

Industry Directory | Inspection / Equipment Dealer / Broker / Manufacturer of Test Equipment

Save time and money by improving the speed and accuracy of your inspections with ERMA - a true 3D viewer intuitively designed for Printed Circuit Board Assembly. Free 14-day trial before you buy.

New SMT Equipment: anys (68733)

Flux Free Formic Acid Reflow Oven - 1936 MKV

Flux Free Formic Acid Reflow Oven - 1936 MKV

New Equipment | Reflow

Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form

Heller Industries Inc.

Convection Reflow Oven Mk7

Convection Reflow Oven Mk7

New Equipment | Reflow

Convection Reflow Oven The World's Best Convection Reflow Oven for High-Throughput The New reflow oven platform revolutionizes the Convection Reflow Oven / Reflow Soldering industry with several new and ground breaking designs! The MK7 convecti

Heller Industries Inc.

Electronics Forum: anys (16015)

LASER SOLDERING

Electronics Forum | Mon Apr 10 11:07:37 EDT 2006 | dougs

Hi, Just wondering if anyone has any experience on any of the inline laser soldering machines available, benchworks, PMJ cencorp, Seica. Any info on any of them would be great. cheers Dougs

Any different between Flat Ribbon and Gull Wing Component?

Electronics Forum | Tue Apr 10 20:32:57 EDT 2007 | raychamp007

Dear Friend, Any one can tell is there any different between Flat Ribbon and Gull Wing Component? Any one pls give an example or provide a picture of flat ribbon component. Thanks.

Used SMT Equipment: anys (1102)

Mydata My100, My200 or My300

Mydata My100, My200 or My300

Used SMT Equipment | Pick and Place/Feeders

We have an immediate need for Mydata My100, MY200 and My300 SMT Pick & Place machines. Any model year is acceptable.

Baja Bid

Fuji MPA3000

Fuji MPA3000

Used SMT Equipment | SMD Placement Machines

2011 FUJI MPA3000 VPD Plus Camera Stand Serial: FJCBO 8040 Features: Program any type of FUJI machine Item Location: Mission, SD USA

Baja Bid

Industry News: anys (3455)

Heller opens Cleanroom in New Jersey Factory.

Industry News | 2013-09-10 17:48:54.0

We are happy to announce that we have opened a new Class 10K cleanroom in the NJ facility.

Heller Industries Inc.

Heller Industries Mark 5 Wins 2012 VISION Award

Industry News | 2012-05-11 20:35:45.0

Heller Industries has been awarded a 2012 SMT VISION Award in the category of Soldering Reflow for its 1936 Mark 5 Reflow Oven. The award was presented on April 25, 2012 at the Nepcon China Exhibition.

Heller Industries Inc.

Parts & Supplies: anys (9461)

Surface Mount Techniques Stainless steel SMT PCB Rack LABERACK Magazine

Surface Mount Techniques Stainless steel SMT PCB Rack LABERACK Magazine

Parts & Supplies | Storage Equipment

Stainless steel SMT PCB Rack LABERACK Magazine Specification: Material:Chroming carbon steel or stainless steel Overall Size: (Any dimensions and specifications are available on request)

KingFei SMT Tech

Surface Mount Techniques Stainless steel SMT PCB Rack LABERACK Magazine

Surface Mount Techniques Stainless steel SMT PCB Rack LABERACK Magazine

Parts & Supplies | SMT Equipment

Stainless steel SMT PCB Rack LABERACK Magazine Specification: Material:Chroming carbon steel or stainless steel Overall Size: (Any dimensions and specifications are available on request)

KingFei SMT Tech

Technical Library: anys (758)

Placement Optimisation in a Lean Manufacturing Environment

Technical Library | 2008-02-20 21:42:52.0

Tier 2 and Tier 3 EMS companies face increasing pressure from competition in low-cost manufacturing countries to produce assembled boards at lower cost, with increased complexity and to tighter deadlines. They also face an increasing amount of high-mix, small-to-mediumvolume production runs. Even OEMs find it hard to predict what products they will be manufacturing in three to five years time, driving the need to invest in highly flexible production tools that will cater to their needs over the lifetime of the equipment. This paper examines methodologies for optimising the process, improving stock control and providing greater traceability using lean manufacturing techniques.

EUROPLACER

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.

Nordson ASYMTEK

Videos: anys (425)

HELLER INDUSTRIES Presents: Formic Acid Sintering

HELLER INDUSTRIES Presents: Formic Acid Sintering

Videos

Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form

Heller Industries Inc.

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Videos

Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Heller Industries Inc.

Training Courses: anys (484)

IPC-A-610 Trainer (CIT) Certification Training Course

Training Courses | | | IPC-A-610 Trainer (CIT)

The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.

Blackfox Training Institute, LLC

IPC J-STD-001 Specialist (CIS) Certification Training Course

Training Courses | | | IPC J-STD-001 Specialist (CIS)

The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.

EPTAC Corporation

Events Calendar: anys (107)

Webinar: Update on New IPC-1752B Supply Chain Standard — Preparing for Submissions to the ECHA SCIP Database

Events Calendar | Thu Dec 05 00:00:00 EST 2019 - Thu Dec 05 00:00:00 EST 2019 | ,

Webinar: Update on New IPC-1752B Supply Chain Standard — Preparing for Submissions to the ECHA SCIP Database

Association Connecting Electronics Industries (IPC)

SMTA Webtorial: Electromigration – The Hurdle For Miniaturization and High Power Devices

Events Calendar | Tue Feb 10 13:00:00 EST 2015 - Tue Feb 10 14:30:00 EST 2015 | ,

SMTA Webtorial: Electromigration – The Hurdle For Miniaturization and High Power Devices

Surface Mount Technology Association (SMTA)

Career Center - Resumes: anys (69)

Electronics Manufacturing - Soldering - SMT and Thru-hole

Career Center | Princeton, Texas USA | Production,Quality Control

I have years of experinece in the electronics field which include: component verification, prepping thru hole parts, building pc boards, soldering thru-hole and smt boards, QA etc.

SMT Technical support

Career Center | Bronx, New York USA | Production,Technical Support

90% of my working experiences, are related with SMT environment: I been dealing with a lot different situation for the last 16 + years. I'm a handyman person as well. know to handle power and precision, etc. For the last year and a half I been in cha

Express Newsletter: anys (330)

Connector Models - Are They Any Good?

Connector Models - Are They Any Good? Connector Models - Are They Any Good? by: Jim Nadolny, Leon Wu; Samtec, Inc. Channel simulations are only as accurate as the models used to develop them. While we have seen much effort placed on printed


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