Industry News | 2013-06-07 15:36:04.0
GPD Global has signed a partnership agreement with Aegis Software to distribute CircuitCAM Express data translation software.
Industry News | 2003-03-19 08:25:45.0
Pilot Program Facilitates Information Exchange Standards in Electronics Manufacturing Industry
Industry News | 2003-04-07 10:16:38.0
Portable Products and Optoelectronic Applications Still Hold Promise for Growth
Industry News | 2003-03-27 08:15:33.0
Modular Embedded Circuit Board from parvus Enables Local Device Fingerprint Biometrics
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2012-08-08 17:44:58.0
IPC Recently released, IPC-7527 was the brainchild of Task Group Nordic (TGNordic), IPC’s volunteer standards development group in Scandinavia.
Industry News | 2013-07-17 14:48:05.0
Count On Tools (COT) Inc. announces a new addition to its custom nozzle engineering services with the Full Solution Package for Odd-Form Components.
Industry News | 2008-02-28 20:26:57.0
The $5000 grant, co-sponsored by SMTA and Circuits Assembly magazine, is awarded annually to a graduate-level student pursuing a degree and working on thesis research in electronic assembly, electronics packaging, or a related field.
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
