Placement Machine SIPLACE E Heads CP14, CP12, CP12/PP, CP6/PP, TH PCB Size(LxW)* 1,200 x 460 mm PCB Thickness 0.3 - 4.5 mm Feeder Capacity 120 x 8 mm Power Supply 3 x 200/208/220/230/380/
ASM SMT Chip Shooter SIPLACE TX If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine, ASM SMT m
Electronics Forum | Thu Sep 24 07:43:12 EDT 1998 | Earl Moon
| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Characterization means det
996 Siemens SIPLACE 80 F3 SMT Pick & Place [includes Wafflepack Changer] Power: 110/208 VAC; 9A; 50/60 Hz Machine Dimensions: 64" x 108" x 68" (excluding light tower) Note: Two Feeder Tables are included in this lot. S/W Version: 010.01 Nozz
Industry News | 2007-01-29 15:10:05.0
Palo Alto, Calif.
Industry News | 2018-03-13 18:51:40.0
SMTA is excited to announce the technical program has been finalized and registration is now open for the South East Asia Technical Conference on Electronics Assembly. The event will be held May 8-10, 2018 at the MITEC in Kuala Lumpur, Malaysia.
40045428 XY BEAR CABLES ASM 40045429 ZT PWR RELAY CABLE ASM 40045430 ZT PWR CABLE ASM A 40045431 ZT PWR CABLE ASM B 40045432 ZT PWR CABLE ASM C 40045433 ZT PWR CABLE ASM D 40045434 LNC60 I/F CABLE ASM 40045436 BANK CABLE ASM. 40045438 CENT-PM
Cheap Wholesale SMT parts Original New JUKI 538 LED NOZZLE ASSEMBLY 40009770 JUKI Nozzle Specifications: Brand Name JUKI NOZZLE Part number 40009770 Model Nozzle 538 Ensure Tested buy juki Guarantee 1 month usage for machine JUKI KE2000 FX
Technical Library | 2007-11-29 17:20:31.0
Programs have been developed to predict the expected yield of flip chip assemblies, based on substrate design and the statistics of actual manufactured boards, as well as placement machine accuracy, variations in bump sizes, and possible substrate warpage. These predictions and the trends they reveal can be used to direct changes in design so that defect levels will fall below the acceptable limits. Shapes of joints are calculated analytically, or when this is not possible, numerically by means of a public domain program called Surface Evolver. The method is illustrated with an example involving the substrate for a flip chip BGA.
Technical Library | 2015-09-23 22:08:32.0
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. (...) Flip chip bonding of bare die on MID can be employed to fully utilize MID’s advantage in device miniaturization. Compared to the traditional soldering process, thermo-compression bonding with gold stud bumps provides a clear advantage in its fine pitch capability. However, challenges also exist. Few studies have been made on thermocompression bonding on MID substrate, accordingly little information is available on process optimization, material compatibility and bonding reliability. Unlike solder reflow, there is no solder involved and no “self-alignment,” therefore the thermo-compression bonding process is significantly more dependent on the capability of the machine for chip assembly alignment.
FOR SALE: Assembleon / Yamaha Opal XII smt pick and place pcb assembly machine running production. This machine is available fully functional from the Capital Equipment Exchange. http://www.ce-exchange.com/detail/assembleon-opal-xii-flex-placer-48
The first technology to use centrifugal energy to clean electronic circuit assemblies, precision parts, and semiconductor packages. The system offers unparalleled penetration, solubilization, and contaminant removal The MicroCel Centrifugal Cleanin
Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support
Duties & Responsibilities (Equipment Technician): Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment. Conduct Preventive maintenance
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
SMTnet Express, November 15, 2018, Subscribers: 31,472, Companies: 11,088, Users: 25,406 Status and Outlooks of Flip Chip Technology John H. Lau; ASM Pacific Technology Status of flip chip technology such as wafer bumping, package substrate, flip
What is an LED Flip Chip? - Dongguan Intercontinental Technology Co.,Ltd. English Français Pусский Español Português Deutsch Italiano 日本語 한국어 Tiếng Việt Türk dili Home About Us Company Profile
K9F4G08U0D-SIB0 Samsung Chip Component Assembled SMT Machine Parts Leave a Message We will call you back soon! Your message must be between 20-3,000 characters