Chip assembly? Classic SMT placement? Our SIPLACE CA can do both. The SIPLACE CA is the world's first placement platform that combines bare-die placement directly from the wafer and classic SMT placement in a single machine and a single production
Precision measurement tool kit for accurracy, repeatabilities, assessment of Chip Shooter, IC Placer, Mechanical and Semi Automatic Flip Chip machine
The ScanCOMPONENT Product helps in creating vision files for your placement machines. It is its own standalone product or a module within the ScanINSPECT VPI product. ScanCOMPONENT is a PC-based offline component programming system for the creatio
PC boards and kits for machine set-up and calibration, hand solder training, rework, practice, testing and more along with a drawing of each PCB. Practical has a PCB board or kit to meet your requirements. BGA Fine Pitch, Global Daisy-Chain or Vari
Bonding forces up to 700 N with outstanding coplanarity. As the versatile FINEPLACER® pico ma system continues to evolve, a new optional configuration has been developed for the latest Anisotropic Conductive Film (ACF) applications. Today's ACF cha
placement machines range from the full-featured, entry level priced, 96 feeder MY9 to the high mix, high volume, 240 feeder MY19. Mydata is famous for flexibility, high mix, ease-of-use, and fast programming yet can place up to 21,000 CPH with the 8
TREK INDUSTRIES is a recognized leader in cleaning equipment for the most demanding applications. This experience in controlled process and precision cleaning has become valuable in working with many critical cleaning applications such as printed ci
TREK INDUSTRIES is a recognized leader in cleaning equipment for the most demanding applications. This experience in controlled process and precision cleaning has become valuable in working with many critical cleaning applications such as printed ci
New Equipment | Solder Materials
BGA Solder Sphere is made from pure metals, to produce exact alloy compositions. We developed and produced under a strict research and quality control policy. Our Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip applications are made by the UM
Welwyn Components� new SMT facility contains the latest manufacturing techniques for both standard and specialist chip resistors. These include high speed/ high precision printing and lasering equipment, grading and tape packing machines and a state
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