Siemens placement machine D4I, SIPLACE D4i high-speed placement machine Model description: 1. Number of cantilevers: 4 2. Number of placement heads: 4 3. IPC speed: 57.000cph 4. SIPLACE benchmark evaluation: 66.000cph 5. Theoretical speed: 81.50
Low Pressure Molding with Macromelt. Low pressure molding is an innovative manufacturing process between injection molding and potting. A cost effective and environmentally friendly alternative to epoxy potting for fragile electronic components. When
Water-based, alkaline defluxing for semiconductor electronics HYDRON® SE 230A is a water-based, single-phase cleaning agent specifically developed for the use in dip tank processes. It removes flux residues from a wide range of semiconductor electro
In the world of makers, people enjoy the fun of designing and developing hardware/ software, even final electronic products. They will not concentrate a lot on the cost and manufacturability. But it is quite different from lab to factory, when it com
Long Foam Cutting Tools EPS Milling Router Bits Ballnose Flat End and Conical These big long series foam end mill, ball nose and conical router bits are widely used with robot milling machine and huge CNC router which used to cut molds from EPS foa
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