Industry Directory: asscon vapor phase (13)

A-Tek Systems Group LLC

A-Tek Systems Group LLC

Industry Directory | Cleaning / Drilling / Routing / Soldering / Distributor / Selective Soldering

Distributor of the highest quality SMT assembly equipment. Our 45 years of combined experience and commitment to excellence have earned us the reputation as the premier distributor in the Americas.

Assembly Resource

Assembly Resource

Industry Directory | Adhesives / Dispensing / Cleaning / Pick and Place / Screen Printing / Manufacturer's Rep

Sales/Marketing, Manufacturers Representatives, Used Equipment Sales

New SMT Equipment: asscon vapor phase (77)

Flux Free Formic Acid Reflow Oven - 1936 MKV

Flux Free Formic Acid Reflow Oven - 1936 MKV

New Equipment | Reflow

Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form

Heller Industries Inc.

McDry Ultra-Low Humidity Storage Cabinets

McDry Ultra-Low Humidity Storage Cabinets

New Equipment | Board Handling - Storage

Prevent your components from micro-cracking during reflow with proper Ultra-Low Humidity Storage. DXU models of maintain1%RH Wide range of cabinets including UL/C models Conforms to IPC/JEDEC J-STD 033B.1 Dehumidifies ICs to prevent micro-crack

Seika Machinery, Inc.

Electronics Forum: asscon vapor phase (235)

problem with vapor phase

Electronics Forum | Mon Aug 12 15:56:13 EDT 2013 | pjchonis

Vapor phase soldering systems by Asscon are characterized by special designed heating modules. The thermal mass of the heating modules is designed so that a completely delay-less and direct regulation of the heat/flow/energy transfer to the soldering

problem with vapor phase

Electronics Forum | Wed Jul 10 16:34:23 EDT 2013 | hegemon

Preheating is critical in Vapor Phase Soldering. One trick that is done is to use the "soft vapor" area just above the soldering vapor, some machines can pause just before going into the soldering vapor. Using that pause above the vapor to continue

Used SMT Equipment: asscon vapor phase (1)

Yamaha YV180XG-M

Yamaha YV180XG-M

Used SMT Equipment | Pick and Place/Feeders

YAMAHA placement machine-YV180Xg equipment parameters: Theoretical mounting speed: 0.095 seconds/CHIP, actual 20000CHIP/H. Production PCB size: L330 x W330 ∼ L50 x W50mm / t = 0.4 ∼ 3.0mm. SMD components range: 0402∼SOP, SOJ, 84 Pin

Qinyi Electronics Co.,Ltd

Industry News: asscon vapor phase (99)

Blakell Europlacer Adds New Products to Its UK Distribution Product Portfolio

Industry News | 2009-12-14 21:11:59.0

DORSET, UNITED KINGDOM - December 2009 - Blakell Europlacer Ltd., a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces the addition of a range of new products to complement its existing product lines, distributed exclusively within the UK.

EUROPLACER

SMTA Launches On-line SMT Processes Re-Certification

Industry News | 2013-08-07 09:58:46.0

The SMTA launched an online re-certification program for engineers whose 10-year SMT Processes Certification is expiring.

Surface Mount Technology Association (SMTA)

Technical Library: asscon vapor phase (62)

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Technical Library | 2020-01-28 00:23:58.0

This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.

Heller Industries Inc.

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Videos: asscon vapor phase (6)

HELLER INDUSTRIES Presents: Formic Acid Sintering

HELLER INDUSTRIES Presents: Formic Acid Sintering

Videos

Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form

Heller Industries Inc.

Removal of baked on fluxes with VIGON® RC 101

Removal of baked on fluxes with VIGON® RC 101

Videos

Based on its MPC® Technology, VIGON® RC 101 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder ovens. It reliably removes re-condensed fluxes and emissions from assemblies. It is also recommended for

ZESTRON Americas

Training Courses: asscon vapor phase (1)

Electronics Manufacturing Mini Camp

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

ACI Technologies, Inc.

Events Calendar: asscon vapor phase (2)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Career Center - Resumes: asscon vapor phase (2)

Arturo C Jadear Jr

Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support

6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process

Printed Circuit Assembly Production/Process Engineer

Career Center | tulsa, Oklahoma | Engineering

Printed Circuit Assembly Process Engineer. Seeking a position in a high-technology operation, utilizing my background supporting a progressive and growth-oriented organization. Offering the technical experience, expertise, and skills gained during th

Express Newsletter: asscon vapor phase (108)

Partner Websites: asscon vapor phase (76)

Preowned Vapor Degreaser Archives - Lewis and Clark

| https://www.lewis-clark.com/product-tag/preowned-vapor-degreaser/

:  Precision Vapor Degreaser Details: Volts: 230v Circuit Amps: 35A Phase Cycle: 1/60 Primary Refrigerant: R-22 Vapor Trap Refrigerant: R-404A Condition: Complete & Operational Location

2015 Micron KEG Supplier Summit

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/06/fluxless-reflow-1.pdf

2015 Micron KEG Supplier Summit CONFIDENTIAL Heller Industries Advanced Oven Technology --Fluxless Reflow-- CONFIDENTIAL Reflow in Formic Acid Vapor

Heller Industries Inc.


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