Electronics Forum | Fri Mar 18 15:02:07 EST 2005 | pmd
Please clarify, Z axis gears (Blades)? The MPM head I believe is what your are asking is driven up and down via a lead screw. The machine gets the zero point from the "HAT" tactile sensor in the table nest. When squegees are installed the blades are
Electronics Forum | Tue Jun 20 19:06:44 EDT 2006 | grantp
Hi, Yes, forget Guru, he's a "tosser" who talks "bolloks". Did you ever notice the English have fantastic words for putting people down? Anyway back to the original question. A manual stencil printer might be ok if your not doing anything too tric
Electronics Forum | Wed Aug 27 14:58:21 EDT 2008 | omid_juve
we have problem in setting the density of a no clean flux for using before wave soldering . first we dilute the flux but we have many short circuit problem between the pads of edge connector,then we densify the flux all the short circuit is removed b
Electronics Forum | Tue Sep 02 14:59:41 EDT 2008 | hermes
if two boards with different solder masks give different results on flux residue level after soldering with the exact same machine settings than it is clear that one of the solder masks is not compatible with your no-clean flux. could be the solder m
Electronics Forum | Thu Aug 28 11:31:17 EDT 2008 | patrickbruneel
Matt solder mask finishes gives the widest process window in view of potential amount of residues when using No-Clean. Shiny (glass like) finishes are more sensitive to residues due to lower surface area compared to matt finish. If the shiny finish i
Electronics Forum | Mon May 31 15:09:56 EDT 1999 | JohnW
| | | | | | | | I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processi
Electronics Forum | Mon May 31 15:10:14 EDT 1999 | JohnW
| | | | | | | | I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processi
Electronics Forum | Fri Oct 08 02:31:07 EDT 1999 | Brian
| | | | Hi, | | | | | | | | Help! Could anyone help to enlighten me on this? | | | | | | | | Question: | | | | | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowab
Electronics Forum | Wed Oct 06 00:26:04 EDT 1999 | Karlin
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Wed Oct 06 08:41:42 EDT 1999 | Dave F
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
