Electronics Forum | Wed Apr 05 11:55:28 EDT 2006 | Cristina Oanca
I am working on a Substrate attach process. The package is gold plated, the preform is AuSn and the backing on the substrate is PdAg. I am using a Sikama reflow furnace. The profile has a 50 sec dwell time. I am over 280 degees C for a little over 1
Electronics Forum | Tue May 21 16:18:57 EDT 2019 | edhare
Interesting problem. I've seen this before on SMT device leads (see Gold Embrittlement paper at http://www.semlab.com). The AuSn4 IMC is solid at typical reflow temperatures and traps volatiles in the solder joint. One usually cannot crank the ref
Industry News | 2016-01-05 14:46:38.0
Indium Corporation will feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016, Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical.
Industry News | 2018-12-16 09:10:36.0
Indium Corporation will feature its precision gold alloy solder preforms at the SPIE Photonics West event, February 2-7, in San Francisco, Calif.
that has fully reflowed is very square to the board
Heller Industries Inc. | https://hellerindustries.com/intermetallic-growth/
. During reflow, with the addition of tin-lead solders, the intermetallic grows. With other board metal finishes, other metallics form, such as AuSn when soldering components to boards with gold-flash finish (and tin-lead solder
Heller 公司 | https://hellerindustries.com.cn/intermetallics-growth
AuSn。 随着时间的推移，金属间层会增长。它的生长速度由热偏移和环境温度决定。金属间化合物的不幸特性之一是它比锡铅焊料或铜（或其他相关金属）更脆。随着时间的推移，随着金属间层变得越来越厚，它就完整性而言成为焊点的致命弱点。根据施加在组件和焊点上的应力，这通常最终会导致焊点开裂和失效。 通常，我们测量数月和数年的金属间化合物生长。然而，在回流过程中，由于高热偏移和锡铅处于熔融状态的事实，金属间生长有所加速。对于双面板，当A侧再次变成液相线时，金属间会进一步增长。如果有修复，修复系统的热量可以诱导正在返修
