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The Regulatory and Environment Status of Tetrabromobisphenol-A In Printed Wiring Boards SMTnet Express August 23, 2012, Subscribers: 25414, Members: Companies: 8957, Users: 33515 The Regulatory and Environment Status of Tetrabromobisphenol
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A NEW PARADIGM FOR DESIGN THROUGH MANUFACTURE SMTnet Express April 20, 2012, Subscribers: 25095, Members: Companies: 8859, Users: 33020 A New Paradigm For Design Through Manufacture Presented at IPC Apex 2012 by: Michael Ford; Valor
Polyphenylene Ether Macromonomers. XI. Use in Non-Epoxy Printed Wiring Boards SMTnet Express November 1, 2012, Subscribers: 25762, Members: Companies: 9029, Users: 33891 Polyphenylene Ether Macromonomers. XI. Use in Non-Epoxy Printed Wiring Boards
Inclusion Voiding in Gull Wing Solder Joints SMTnet Express August 30, 2012, Subscribers: 25432, Members: Companies: 8960, Users: 33565 Inclusion Voiding in Gull Wing Solder Joints First published in the 2012 IPC APEX EXPO technical conference
Advances in Conductive Inks across Multiple Applications and Deposition Platforms SMTnet Express December 27, 2012, Subscribers: 26070, Members: Companies: 9073, Users: 34093 Advances in Conductive Inks across Multiple Applications and Deposition
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