New Equipment | Industrial Automation
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New Equipment | Test Equipment - Bond Testers
Fully integrated solution for automated wafer testing (up to 300 mm). The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages av
Electronics Forum | Sun Jul 28 15:20:08 EDT 2002 | davef
'Good Old Days', hummm, sounds dangerous from the start. Dunno, Bill. While they're corrosion oriented, but have you considered: * ASTM D2247, Procedure for Humidity Testing * ASTM B117, Procedure for Salt Spray Testing (Fog Testing)
The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages available in the industry, to reach all positions on the wafer with the t
