Industry Directory | Manufacturer
Industry leader in back-end assembly for the semiconductor industry.
Industry Directory | Manufacturer
Provides Back-end Tape and Reel and Lead Scan Services
New Equipment | Solder Paste Stencils
MPM UP2000 HiE Screen Printer Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps
Front End and Back End Yaskawa Wafer Robots, Ebara Pumps, Boc Edwards Pumps, Affinity Chillers, ASM, Karl Suss, Agilent, Tencor, EVG, GSI, ESEC, Besi, Kulicke and Soffa, K&S, MRSI, Temptronic View our inventory or call us at 978-790-2774
Electronics Forum | Tue Dec 03 09:54:20 EST 2019 | davef
CURIOUS MINDS WANT TO KNOW Which processes are "front end" and which are "back end"? Why are they separated like that? Why are "front end" and "back end" processes usually done in separate plants? What are the high-value activities? Which activi
Electronics Forum | Wed Sep 21 05:33:34 EDT 2005 | Selva Govind
It's me again I post it before complete the message. Let me start once again. I plan, schedule and deliver SMT production programs for HMLV plant(app 1200 Assemblies). The kind of floor loading I have here is works great for SMT only. I'm considering
Used SMT Equipment | Screen Printers
MPM UP2000HiE PRINTER Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps) Thickness rang
Used SMT Equipment | Conveyors
2 x Nutek NTM110LL PCB handler/magazine front end line loader & Nutek NT110UL PCB handler,magazine back end line unloader maximum 15"PCB ,The machine operates left to right Contact us for details & pictures
Industry News | 2021-11-08 14:38:39.0
Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
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Parts & Supplies | Pick and Place/Feeders
YAMAHA KLJ-MC641-00 tape guide assy.44 KLJ-MC641-00 tape guide assy.44 YAMAHA YS12, YS24, YS88, YS100, YSM10, YSM20, YSM40R mounter electric FEEDER YAMAHA SS electric 8mm feeder KHJ-MC100-000 YAMAHA SS electric 12/16mm feeder KHJ-MC200
Technical Library | 2020-02-26 23:24:02.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-inpackage (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Technical Library | 2021-06-15 15:17:33.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-in-package (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Using Lei Sai step control system, precision screw, stable and reliable performance. SMT line body with less NG board can be realized. Can be adjusted according to the height of the specific front and back position machine. It is used for AOI or
I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the cir
Career Center | Milpitas, California USA | Clerical,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking a ‘hands on’ Materials Engineer to join our Test services team. This individual wi
Career Center | San Jose, California USA | Engineering,Research and Development
Will be responsible for development and socketization tasks involving new and acquired IP cores. Required skills (under I and II) include but are not limited to: (I) in-depth working knowledge of microprocessor-based systems and peripherals. The kn
Career Center | King, North Carolina | Management,Production,Quality Control
Production Supervisor Responsible for all aspects of department operations Directly supervised up to 80 team members Kaizen team leader 5S, Lean Manufacturing, working with Six Sigma tools Built team that continually produced 98% yields and Won
Career Center | THRISSUR, India | Maintenance,Production
HANDLING OF MAINTENANCE Camelot,Mascot, Selective Soldering,Wave Soldering,Aquastorm 200,H-500 HI-Z,Kolb,kerry&PBT,GETECH, ATI 105 & Final Touch 101,Heller,Btu&vapour phase,Shuttle,SRT,ESD ,Electrical maintenance . Knowledge in using SLIM KIC 2000&
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Pressure Curing Ovens & Back-end Semiconductor Manufacturing Equipment-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News
Heller 公司 | https://hellerindustries.com.cn/curing-back-end-semiconductor/
. 安排在线演示 Schedule an online presentation and have your semiconductor manufacturing questions answered. Pressure Curing Ovens & Back-End Semiconductor Manufacturing Equipment Videos See Semiconductor Manufacturing Equipment Video Heller's Semiconductor Manufacturing Equipment Global Network Visit Us We welcome you to visit
