dry cabinet, dehumidifier, low temp bake oven, dry box gloves
EcoTech distributes new and reprocessed plastic IC trays for use in the testing, baking, handling and shipping of Surface Moount ICs.
New Equipment | Solder Paste Stencils
Product material: stainless steel (internal) + steel plate baking paint Storage quantity: 36 cans of tin paste Product weight: 13kg Product size: 495 * 750 * 95mm Application: SMT workshop solder paste storage control, first in, first out
New Equipment | Coating Equipment
QYSMT / MOREL Automatic seal detection conveyor 1. Control part: button type control, simple and easy to understand:Rack part. 2. The frame is designed and manufactured by the processof full sheet metal welding and electrostatic powder baking powd
Electronics Forum | Wed Aug 21 07:24:12 EDT 2002 | bayanbaru
What is the correct method to bake or cure the component?Standard baking practise by us is to place the units into oven at 125 �C for 8 hrs directly. But I was told that the correct baking practise is to cool down the Baking Oven to Room temp and onl
Electronics Forum | Wed Mar 23 10:16:47 EDT 2011 | blnorman
If these are moisture sensitive they are required to be shipped in a moisture barrier bag and labeled as moisture sensitive. Depending on which moisture sensitivity level (MSL) the components have, floor life can range from unlimited to a mandatory
Used SMT Equipment | Assembly Accessories
Bench top Blue M bakiing oven with shelves, temp indicator, 110VAC, complete and operational. 17x17x11.5 chamber area. Temp Range 200c FOB: Origin Contact: AssuredTechnicalServiceLLC@Gmail.com
Used SMT Equipment | Drying Equipment
Despatch Bake Oven FOB: Origin Contact AssuredTechnicalServiceLLC@Gmail.com ND5
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2014-08-04 16:04:28.0
Mark Capizzi appointed as Equipment Marketing and Support Manager
Parts & Supplies | Pick and Place/Feeders
we have feeder storage cart in stock. Features and Benefits 2 Feeder shelves with anodized aluminum plates to locate and secure feeder to cart. Tooling designed per manufacturer’s specifications. Feeder Shelves are 35.5” long, positioned per fe
Parts & Supplies | Chipshooters / Chip Mounters
Product size (mm): L350*W260*H235 G.W: 12KG Product material: stainless steel plate Samsung SM feeder feeding Loading Unit is made of high-quality steel baking paint, which is used for feeder offline loading, and can hold 10 feeder at the same t
Technical Library | 2023-09-23 22:31:52.0
Dry boxes can be implemented at various points within the Mfg. environment; for med-long term inventory, or for short term handling on the production floor, and in some cases (with certain conditions) as a process replacement for baking. Bare boards, raw components and partially assembled PCB's can benefit from ultra-low humidity storage.
Technical Library | 2019-05-30 10:59:13.0
In the current economic environment, the ability to reuse ball grid array(BGA) components that have failed due to solder defects may be an efficient way for electronics manufacturers to reduce costs. Cost may not be the only driving factor in the decision to engage in this recycling practice. The increasing demands placed upon the complexity of microprocessors and integrated circuits (ICs) has decreased the availability of some components, and increased their lead time. Because of this, reballing may provide a means to meet schedule, reduce rework turn-around time, and give a manufacturer a decisive advantage over other companies in an ever increasingly competitive market. This article will discuss the process of reballing BGA components (Figure 1), examining preparation (the preform method, the screen method), and cleaning and bake-out.
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | , South Jersey USA | Production
I know this has nothing to do with electronics, but if any of you in New Jersey, or Philly, want to start your own Italian Deli Bakery business, here's a chance to get into a restaurant. I wish I had a company that would let me sell them products o
Career Center | THRISSUR, India | Maintenance,Production
HANDLING OF MAINTENANCE Camelot,Mascot, Selective Soldering,Wave Soldering,Aquastorm 200,H-500 HI-Z,Kolb,kerry&PBT,GETECH, ATI 105 & Final Touch 101,Heller,Btu&vapour phase,Shuttle,SRT,ESD ,Electrical maintenance . Knowledge in using SLIM KIC 2000&
Career Center | Theni, Tamilnadu India | Engineering
NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
Imagineering, Inc. | https://www.pcbnet.com/services/assembly/turn-key/
. With 18 nozzles in total, we are capable of mounting a vast mix of component types. Component baking – Our 8-zone reflow oven can meet all your component baking requirements
| http://etasmt.com/cc?ID=te_news_bulletin,23574&url=_print
. (Some practitioners pre-bake components and boards to drive out moisture. This is not encouraged and should be a last resort as baking tends to build intermetallics as well as degrade the solderability by increasing oxidation levels
